Bomkey (HK) Elektronik GmbH!

    IC-Sockel

    Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

    Alle zurücksetzen
    Alle anwenden
    Ergebnis
    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
    10-8535-210C

    10-8535-210C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,462
    RFQ
    10-8535-210C

    Datenblatt

    8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-8810-210C

    10-8810-210C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,944
    RFQ
    10-8810-210C

    Datenblatt

    8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-8500-611C

    14-8500-611C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,331
    RFQ
    14-8500-611C

    Datenblatt

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    1108883-05

    1108883-05

    SERIES 0517 PIN-LINE VERTISOCKET

    Aries Electronics

    3,827
    RFQ
    1108883-05

    Datenblatt

    - - Active - - - - - - - - - - - - - - -
    1109800-14

    1109800-14

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,142
    RFQ
    1109800-14

    Datenblatt

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109800-16

    1109800-16

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,229
    RFQ
    1109800-16

    Datenblatt

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109800-20

    1109800-20

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    1,718
    RFQ
    1109800-20

    Datenblatt

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109800-28

    1109800-28

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    1,903
    RFQ
    1109800-28

    Datenblatt

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109800-10

    1109800-10

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,363
    RFQ
    1109800-10

    Datenblatt

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109800-12

    1109800-12

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    2,106
    RFQ
    1109800-12

    Datenblatt

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109800-22

    1109800-22

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,440
    RFQ
    1109800-22

    Datenblatt

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109800-24

    1109800-24

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    1,882
    RFQ
    1109800-24

    Datenblatt

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109800-26

    1109800-26

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    2,093
    RFQ
    1109800-26

    Datenblatt

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109800-8

    1109800-8

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,817
    RFQ
    1109800-8

    Datenblatt

    Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109681-308

    1109681-308

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,808
    RFQ
    1109681-308

    Datenblatt

    - Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109681-316

    1109681-316

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,588
    RFQ
    1109681-316

    Datenblatt

    - Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109681-632

    1109681-632

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,519
    RFQ
    1109681-632

    Datenblatt

    - Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    1109681-648

    1109681-648

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    1,831
    RFQ
    1109681-648

    Datenblatt

    - Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    54020-68030LF

    54020-68030LF

    CONN SOCKET PLCC 68POS TIN

    Amphenol ICC (FCI)

    2,597
    RFQ
    54020-68030LF

    Datenblatt

    - Tube Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyphenylene Sulfide (PPS) -40°C ~ 105°C
    54020-52030LF

    54020-52030LF

    CONN SOCKET PLCC 52POS TIN

    Amphenol ICC (FCI)

    2,495
    RFQ
    54020-52030LF

    Datenblatt

    - Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyphenylene Sulfide (PPS) -40°C ~ 105°C
    Total 19086 Record«Prev1... 940941942943944945946947...955Next»
    Kontaktieren Sie uns Mehr Produktinformationen erhalten!
    BomKey Elektronik

    Startseite

    BomKey Elektronik

    Produkte

    BomKey Elektronik

    Telefon

    BomKey Elektronik

    Benutzer

    Günstige Preise jeden Tag, sorgenfreie Auswahl.
    Günstige Preise jeden Tag, sorgenfreie Auswahl.
    Echte lizenzierte Waren, exzellenter Service.
    Echte lizenzierte Waren, exzellenter Service.
    Direktlieferung aus mehreren Lagern, schnelle Lieferung.
    Direktlieferung aus mehreren Lagern, schnelle Lieferung.
    Vollständige Produktpalette für einfaches Einkaufen.
    Vollständige Produktpalette für einfaches Einkaufen.
    Copyright © 2025 Bomkey Elektronik. Alle Rechte vorbehalten