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    Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
    8080-1G2

    8080-1G2

    CONN SOCKET TRANSIST TO-3 3POS

    TE Connectivity AMP Connectors

    1,284
    RFQ
    8080-1G2

    Datenblatt

    - Bulk Obsolete Transistor, TO-3 3 (Oval) - Silver 500.0µin (12.70µm) Beryllium Copper Through Hole Closed Frame Solder - Silver - Beryllium Copper Diallyl Phthalate (DAP) -55°C ~ 125°C
    8080-1G3

    8080-1G3

    CONN SOCKET TRANSIST TO-3 3POS

    TE Connectivity AMP Connectors

    3,914
    RFQ
    8080-1G3

    Datenblatt

    - Bulk Obsolete Transistor, TO-3 3 (Oval) - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder - Tin-Lead - Beryllium Copper Phenolic -55°C ~ 125°C
    8080-1G35

    8080-1G35

    CONN SOCKET TRANSIST TO-3 3POS

    TE Connectivity AMP Connectors

    2,722
    RFQ
    8080-1G35

    Datenblatt

    - Bulk Obsolete Transistor, TO-3 3 (Oval) - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin-Lead 20.0µin (0.51µm) Beryllium Copper Diallyl Phthalate (DAP) -55°C ~ 125°C
    8080-1G36

    8080-1G36

    CONN SOCKET TRANSIST TO-3 3POS

    TE Connectivity AMP Connectors

    4,865
    RFQ
    8080-1G36

    Datenblatt

    - Bulk Obsolete Transistor, TO-3 3 (Oval) - Silver 500.0µin (12.70µm) Beryllium Copper Chassis Mount Closed Frame Solder - Silver 500.0µin (12.70µm) Beryllium Copper Phenolic -55°C ~ 125°C
    8080-1G37

    8080-1G37

    CONN SOCKET TRANSIST TO-3 3POS

    TE Connectivity AMP Connectors

    3,159
    RFQ
    8080-1G37

    Datenblatt

    - Bulk Obsolete Transistor, TO-3 3 (Oval) - Silver 500.0µin (12.70µm) Beryllium Copper Chassis Mount Closed Frame Solder - Silver 500.0µin (12.70µm) Beryllium Copper Diallyl Phthalate (DAP) -55°C ~ 125°C
    8-1437504-6

    8-1437504-6

    CONN SOCKET TRANSIST TO-3 3POS

    TE Connectivity AMP Connectors

    4,202
    RFQ
    8-1437504-6

    Datenblatt

    8080 Bulk Active Transistor, TO-3 3 (Oval) - Gold 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Diallyl Phthalate (DAP) -55°C ~ 125°C
    824-AG66D

    824-AG66D

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    2,532
    RFQ
    824-AG66D

    Datenblatt

    800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
    9-1437537-3

    9-1437537-3

    CONN IC DIP SOCKET 3POS GOLD

    TE Connectivity AMP Connectors

    3,054
    RFQ
    9-1437537-3

    Datenblatt

    800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 3 (1 x 3) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
    9-1437539-6

    9-1437539-6

    CONN IC DIP SOCKET 6POS GOLD

    TE Connectivity AMP Connectors

    2,675
    RFQ
    9-1437539-6

    Datenblatt

    800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
    2040636-5

    2040636-5

    CONN SOCKET LGA 1567POS GOLD

    TE Connectivity AMP Connectors

    3,214
    RFQ
    2040636-5

    Datenblatt

    - Tray Active LGA 1567 0.040" (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.039" (1.00mm) - - Copper Alloy Thermoplastic -
    1977291-1

    1977291-1

    CONN IC DIP SOCKET 20POS GOLD

    TE Connectivity AMP Connectors

    3,047
    RFQ
    1977291-1

    Datenblatt

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) - - Brass Thermoplastic, Polyester -
    8-1437529-1

    8-1437529-1

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    4,594
    RFQ
    8-1437529-1

    Datenblatt

    500 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 47.2µin (1.20µm) Copper Alloy Thermoplastic, Polyester -55°C ~ 105°C
    1825088-2

    1825088-2

    CONN IC DIP SOCKET 12POS GOLD

    TE Connectivity AMP Connectors

    4,829
    RFQ
    1825088-2

    Datenblatt

    - Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Press-Fit 0.100" (2.54mm) - - Brass Thermoplastic, Polyester -
    8-1437531-4

    8-1437531-4

    520-AG11F=SOCKET ASSY

    TE Connectivity AMP Connectors

    1,362
    RFQ
    8-1437531-4

    Datenblatt

    500 Bulk Active - - - - - - - - - - - - - - -
    1747890-1

    1747890-1

    DSL ASSY LGA771 LEADED

    TE Connectivity AMP Connectors

    3,324
    RFQ
    1747890-1

    Datenblatt

    - Tray Active LGA 771 (33 x 33) 0.043" (1.09mm) - - Copper Alloy Surface Mount - Solder 0.043" (1.09mm) Tin - - Thermoplastic -25°C ~ 100°C
    1-1981837-2

    1-1981837-2

    CONN SOCKET LGA 1366POS GOLD

    TE Connectivity AMP Connectors

    3,536
    RFQ
    1-1981837-2

    Datenblatt

    - Tray Active LGA 1366 (32 x 41) 0.040" (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.040" (1.01mm) - - - Thermoplastic -
    1825532-4

    1825532-4

    CONN SOCKET SIP 10POS GOLD

    TE Connectivity AMP Connectors

    2,707
    RFQ
    1825532-4

    Datenblatt

    - - Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin Flash Beryllium Copper Polyester -
    4-2013620-3

    4-2013620-3

    CONN SOCKET PGA ZIF 989POS GOLD

    TE Connectivity AMP Connectors

    1,928
    RFQ
    4-2013620-3

    Datenblatt

    - Tape & Reel (TR) Active PGA, ZIF (ZIP) 989 (35 x 36) 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039" (1.00mm) Tin-Lead 15.0µin (0.38µm) Copper Alloy Thermoplastic -
    1-2013620-1

    1-2013620-1

    CONN SOCKET PGA ZIF 989POS GOLD

    TE Connectivity AMP Connectors

    4,521
    RFQ
    1-2013620-1

    Datenblatt

    - Tape & Reel (TR) Active PGA, ZIF (ZIP) 989 (35 x 36) 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039" (1.00mm) Tin-Lead 15.0µin (0.38µm) Copper Alloy Thermoplastic -
    9-6437529-4

    9-6437529-4

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    3,819
    RFQ
    9-6437529-4

    Datenblatt

    - Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Thermoplastic, Polyester -
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