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    Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
    1-2199298-2

    1-2199298-2

    CONN IC DIP SOCKET 8POS TIN

    TE Connectivity AMP Connectors

    9,722
    RFQ
    1-2199298-2

    Datenblatt

    Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass, Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    A 14-LC-TT

    A 14-LC-TT

    CONN IC DIP SOCKET 14POS TIN

    Assmann WSW Components

    15,964
    RFQ
    A 14-LC-TT

    Datenblatt

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    ED281DT

    ED281DT

    CONN IC DIP SOCKET 28POS TIN

    On Shore Technology Inc.

    4,058
    RFQ
    ED281DT

    Datenblatt

    ED Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 110°C
    SA083040

    SA083040

    CONN IC DIP SOCKET 8POS GOLD

    On Shore Technology Inc.

    1,301
    RFQ
    SA083040

    Datenblatt

    SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 80.0µin (2.03µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    110-87-308-41-001101

    110-87-308-41-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    20,714
    RFQ
    110-87-308-41-001101

    Datenblatt

    110 Box Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 08-HZL-TT

    AR 08-HZL-TT

    CONN IC DIP SOCKET 8POS TIN

    Assmann WSW Components

    20,914
    RFQ
    AR 08-HZL-TT

    Datenblatt

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    4808-3004-CP

    4808-3004-CP

    CONN IC DIP SOCKET 8POS TIN

    3M

    37,370
    RFQ
    4808-3004-CP

    Datenblatt

    4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
    A 40-LC-TT

    A 40-LC-TT

    CONN IC DIP SOCKET 40POS TIN

    Assmann WSW Components

    1,066
    RFQ
    A 40-LC-TT

    Datenblatt

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    110-44-308-41-001000

    110-44-308-41-001000

    CONN IC DIP SOCKET 8POS TIN

    Mill-Max Manufacturing Corp.

    4,620
    RFQ
    110-44-308-41-001000

    Datenblatt

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    SA143000

    SA143000

    CONN IC DIP SOCKET 14POS GOLD

    On Shore Technology Inc.

    2,371
    RFQ
    SA143000

    Datenblatt

    SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    SA163000

    SA163000

    CONN IC DIP SOCKET 16POS GOLD

    On Shore Technology Inc.

    2,514
    RFQ
    SA163000

    Datenblatt

    SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    DILB40P-223TLF

    DILB40P-223TLF

    CONN IC DIP SOCKET 40POS TIN

    Amphenol ICC (FCI)

    6,719
    RFQ
    DILB40P-223TLF

    Datenblatt

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 105°C
    AR 16-HZL-TT

    AR 16-HZL-TT

    CONN IC DIP SOCKET 16POS TIN

    Assmann WSW Components

    3,453
    RFQ
    AR 16-HZL-TT

    Datenblatt

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    110-43-308-41-001000

    110-43-308-41-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    14,042
    RFQ
    110-43-308-41-001000

    Datenblatt

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-308-41-001000

    110-93-308-41-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    2,161
    RFQ
    110-93-308-41-001000

    Datenblatt

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    A-CCS 032-Z-SM

    A-CCS 032-Z-SM

    IC PLCC SOCKET 32POS TIN SMD

    Assmann WSW Components

    766
    RFQ
    A-CCS 032-Z-SM

    Datenblatt

    - Tube Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyamide (PA9T), Nylon 9T, Glass Filled -40°C ~ 105°C
    110-99-316-41-001000

    110-99-316-41-001000

    CONN IC DIP SOCKET 16POS TINLEAD

    Mill-Max Manufacturing Corp.

    1,423
    RFQ
    110-99-316-41-001000

    Datenblatt

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-87-308-41-105191

    110-87-308-41-105191

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    3,488
    RFQ
    110-87-308-41-105191

    Datenblatt

    110 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1050281001

    1050281001

    CONN CAM SOCKET 32POS GOLD

    Molex

    14,741
    RFQ
    1050281001

    Datenblatt

    105028 Tape & Reel (TR) Active Camera Socket 32 (4 x 8) 0.035" (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Nickel 50.0µin (1.27µm) Copper Alloy Thermoplastic -
    69802-432LF

    69802-432LF

    CONN SOCKET PLCC 32POS TIN

    Amphenol ICC (FCI)

    209
    RFQ
    69802-432LF

    Datenblatt

    - Tape & Reel (TR) Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
    Total 19086 Record«Prev1234...955Next»
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