852-69415941
IC-Sockel
| Foto | Hersteller-Teilenr. | Verfügbarkeit | Menge | Datenblatt | Serie | Verpackung | Produktstatus | Typ | Anzahl der Positionen oder Stifte (Gitter) | Abstand - Paarung | Kontaktoberfläche – Paarung | Kontaktoberflächendicke - Paarung | Kontaktmaterial - Paarung | Montageart | Funktionen | Anschluss | Abstand - Pfosten | Kontaktoberfläche - Pfosten | Kontaktoberflächendicke - Pfosten | Kontaktmaterial - Pfosten | Gehäusematerial | Betriebstemperatur |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
210931-1CONN SOCKET SIP GOLD |
4,533 |
|
Datenblatt |
- | Tape & Reel (TR) | Active | SIP | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Brass | Thermoplastic, Polyester, Glass Filled | - |
|
|
2134397-1CONN SOCKET LGA 115POS |
2,208 |
|
Datenblatt |
LGH | Bulk | Active | LGA | 115 | - | - | - | - | Surface Mount | Open Frame | Solder | - | - | - | - | Polycarbonate Film | - |
|
|
D84032B-46CONN SOCKET PLCC 32POS TIN |
4,444 |
|
Datenblatt |
D830 | Tube | Obsolete | PLCC | 32 (4 x 8) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) | -50°C ~ 105°C |
|
|
1640258-9CONN SOCKET PGA 576POS GOLD |
2,595 |
|
Datenblatt |
- | - | Obsolete | PGA | 576 (24 x 24) | 0.039" (1.00mm) | Gold | - | - | Surface Mount | Closed Frame | Solder | 0.039" (1.00mm) | Gold | - | - | Polyamide (PA), Nylon | - |
|
|
5-2013620-3CONN SOCKET PGA ZIF 989POS GOLD |
2,642 |
|
Datenblatt |
- | Bulk | Obsolete | PGA, ZIF (ZIP) | 989 (35 x 36) | 0.039" (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039" (1.00mm) | Tin-Lead | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic | - |
|
|
8-1437504-9CONN SOCKET TRANSIST TO-3 3POS |
4,428 |
|
Datenblatt |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Copper | 100.0µin (2.54µm) | Beryllium Copper | Phenolic | -55°C ~ 125°C |
|
|
9-1437504-4CONN SOCKET TRANSIST TO-3 3POS |
1,212 |
|
Datenblatt |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Silver | 500.0µin (12.70µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | - | - | Beryllium Copper | Phenolic | -55°C ~ 125°C |
|
|
9-1437504-8CONN SOCKET TRANSIST TO-3 3POS |
3,777 |
|
Datenblatt |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Silver | 50.0µin (1.27µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | - | - | Beryllium Copper | Diallyl Phthalate (DAP) | -55°C ~ 125°C |
|
|
9-1437508-5CONN SOCKET TRANSIST TO-5 4POS |
2,249 |
|
Datenblatt |
- | Bulk | Obsolete | Transistor, TO-5 | 4 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin | - | Brass | Polyamide (PA), Nylon, Glass Filled | -55°C ~ 125°C |
|
|
1051420432CONN SOCKET LGA 2011POS GOLD |
2,914 |
|
Datenblatt |
105142 | Bulk | Obsolete | LGA | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | - | - | Copper Alloy | Thermoplastic | - |
|
|
APA-308-G-KADAPTER PLUG |
2,826 |
|
Datenblatt |
APA | Bulk | Active | - | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
|
|
APA-322-G-KADAPTER PLUG |
4,388 |
|
Datenblatt |
APA | Bulk | Active | - | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
|
|
APA-322-T-PADAPTER PLUG |
4,461 |
|
Datenblatt |
APA | Bulk | Active | - | 22 (2 x 11) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
|
|
APA-640-T-KADAPTER PLUG |
4,143 |
|
Datenblatt |
APA | Bulk | Active | - | 40 (2 x 20) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
|
540-AG11D-ESCONN IC DIP SOCKET 40POS GOLD |
2,333 |
|
Datenblatt |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
|
|
1050282011CONN CAMERA SOCKET 32POS GOLD |
2,235 |
|
Datenblatt |
105028 | Bulk | Obsolete | Camera Socket | 32 (4 x 8) | 0.035" (0.90mm) | Gold | 12.0µin (0.30µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035" (0.90mm) | Gold | Flash | Copper Alloy | Plastic | -55°C ~ 85°C |
|
|
268-4204-013M TEXTOOL OPEN-TOP SOCKETS FOR |
3,177 |
|
Datenblatt |
Textool™ | Box | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
2A8-4204-003M TEXTOOL OPEN-TOP SOCKETS FOR |
4,181 |
|
Datenblatt |
Textool™ | Box | Discontinued at Digi-Key | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
101-93-648-41-560000SKT IC |
2,374 |
|
Datenblatt |
101 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
110-88-306-41-530000CONN IC SKT DBL |
2,329 |
|
Datenblatt |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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