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    Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
    1939416-1

    1939416-1

    CONN SOCKET LGA 1207POS GOLD

    TE Connectivity AMP Connectors

    2,670
    RFQ
    1939416-1

    Datenblatt

    - Tray Active LGA 1207 (33 x 34) 0.043" (1.09mm) Gold - Beryllium Copper Surface Mount Closed Frame Solder 0.043" (1.09mm) - - - Thermoplastic -55°C ~ 110°C
    516-AG7D

    516-AG7D

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    4,174
    RFQ
    516-AG7D

    Datenblatt

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Copper Alloy Polyester -55°C ~ 125°C
    1939416-2

    1939416-2

    CONN SOCKET LGA 1207POS GOLD

    TE Connectivity AMP Connectors

    3,860
    RFQ
    1939416-2

    Datenblatt

    - Tray Active LGA 1207 (33 x 34) 0.043" (1.09mm) Gold - Beryllium Copper Surface Mount Closed Frame Solder 0.043" (1.09mm) - - - Thermoplastic -55°C ~ 110°C
    2-641262-4

    2-641262-4

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    1,781
    RFQ
    2-641262-4

    Datenblatt

    Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    1-1437538-3

    1-1437538-3

    CONN IC DIP SOCKET 28POS TINLEAD

    TE Connectivity AMP Connectors

    4,327
    RFQ
    1-1437538-3

    Datenblatt

    800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead - Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    1554116-2

    1554116-2

    CONN SOCKET LGA 1356POS GOLD

    TE Connectivity AMP Connectors

    3,289
    RFQ
    1554116-2

    Datenblatt

    - Tray Obsolete LGA 1356 (32 x 41) 0.040" (1.02mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.040" (1.01mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic -25°C ~ 100°C
    1554116-3

    1554116-3

    CONN SOCKET LGA 1356POS GOLD

    TE Connectivity AMP Connectors

    2,464
    RFQ
    1554116-3

    Datenblatt

    - Tray Obsolete LGA 1356 (32 x 41) 0.040" (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.040" (1.01mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -25°C ~ 100°C
    1761122-1

    1761122-1

    POWER ASSY

    TE Connectivity AMP Connectors

    1,456
    RFQ
    1761122-1

    Datenblatt

    - Bulk Active LGA 145 0.050" (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic, Glass Filled -
    1939737-1

    1939737-1

    CONN SOCKET LGA 1366POS

    TE Connectivity AMP Connectors

    2,886
    RFQ
    1939737-1

    Datenblatt

    - Tray Obsolete LGA 1366 (32 x 41) - - - - - - - - - - - - -
    8059-2G2

    8059-2G2

    CONN TRANSIST TO-5 3POS GOLD

    TE Connectivity AMP Connectors

    1,063
    RFQ
    8059-2G2

    Datenblatt

    8059 Bulk Obsolete Transistor, TO-5 3 (Round) - Gold - Copper Alloy Through Hole - Solder - Gold - Copper Alloy Polyamide (PA), Nylon -55°C ~ 125°C
    5-1437530-2

    5-1437530-2

    CONN IC SIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    3,660
    RFQ
    5-1437530-2

    Datenblatt

    500 Tube Obsolete SIP 8 (1 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead - Brass Polyester -55°C ~ 125°C
    528-AG11D

    528-AG11D

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    2,110
    RFQ
    528-AG11D

    Datenblatt

    500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    808-AG12D

    808-AG12D

    CONN IC DIP SOCKET 8POS TIN-LEAD

    TE Connectivity AMP Connectors

    2,571
    RFQ
    808-AG12D

    Datenblatt

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin-Lead - Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    506-AG11D-ES

    506-AG11D-ES

    CONN IC DIP SOCKET 6POS GOLD

    TE Connectivity AMP Connectors

    1,526
    RFQ
    506-AG11D-ES

    Datenblatt

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    2-382468-4

    2-382468-4

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    2,915
    RFQ
    2-382468-4

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Phosphor Bronze Thermoplastic -55°C ~ 125°C
    2-382712-1

    2-382712-1

    CONN IC DIP SOCKET 16POS TIN

    TE Connectivity AMP Connectors

    4,999
    RFQ
    2-382712-1

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    8080-1G7

    8080-1G7

    CONN TRANSIST TO-3 4POS GOLD

    TE Connectivity AMP Connectors

    3,251
    RFQ
    8080-1G7

    Datenblatt

    8080 Bulk Obsolete Transistor, TO-3 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Fluoropolymer (FP) -55°C ~ 125°C
    822064-5

    822064-5

    CONN SOCKET PQFP 132POS TIN-LEAD

    TE Connectivity AMP Connectors

    4,256
    RFQ
    822064-5

    Datenblatt

    - Tube Active QFP 132 (4 x 33) 0.025" (0.64mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.025" (0.64mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
    1814655-7

    1814655-7

    CONN SOCKET SIP 10POS GOLD

    TE Connectivity AMP Connectors

    2,529
    RFQ
    1814655-7

    Datenblatt

    - Bulk Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
    2-382719-1

    2-382719-1

    CONN IC DIP SOCKET 30POS TIN

    TE Connectivity AMP Connectors

    2,876
    RFQ
    2-382719-1

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 936937938939940941942943...955Next»
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