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    Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
    69802-120LF

    69802-120LF

    CONN SOCKET PLCC 20POS TIN

    Amphenol ICC (FCI)

    1,845
    RFQ
    69802-120LF

    Datenblatt

    - Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
    69802-168LF

    69802-168LF

    CONN SOCKET PLCC 68POS TIN

    Amphenol ICC (FCI)

    1,245
    RFQ
    69802-168LF

    Datenblatt

    - Tube Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
    814-AG11D-ESL-LF

    814-AG11D-ESL-LF

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    3,692
    RFQ
    814-AG11D-ESL-LF

    Datenblatt

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    828-AG11D-ESL-LF

    828-AG11D-ESL-LF

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    1,725
    RFQ
    828-AG11D-ESL-LF

    Datenblatt

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    4-1571552-4

    4-1571552-4

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    4,548
    RFQ
    4-1571552-4

    Datenblatt

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    4-1571552-9

    4-1571552-9

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    4,565
    RFQ
    4-1571552-9

    Datenblatt

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    1-822473-5

    1-822473-5

    CONN SOCKET PLCC 52POS TIN

    TE Connectivity AMP Connectors

    4,181
    RFQ
    1-822473-5

    Datenblatt

    - Box Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
    5-1571552-2

    5-1571552-2

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    2,212
    RFQ
    5-1571552-2

    Datenblatt

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    808-AG11D-ES-LF

    808-AG11D-ES-LF

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    1,519
    RFQ
    808-AG11D-ES-LF

    Datenblatt

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    2-1571586-9

    2-1571586-9

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    3,956
    RFQ
    2-1571586-9

    Datenblatt

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    508-AG10D

    508-AG10D

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    2,227
    RFQ
    508-AG10D

    Datenblatt

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy - -55°C ~ 125°C
    516-AG10D

    516-AG10D

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    2,265
    RFQ
    516-AG10D

    Datenblatt

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C
    2-641616-1

    2-641616-1

    CONN IC DIP SOCKET 40POS TIN

    TE Connectivity AMP Connectors

    3,643
    RFQ
    2-641616-1

    Datenblatt

    Diplomate DL Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic -55°C ~ 105°C
    5-1571551-0

    5-1571551-0

    CONN IC DIP SOCKET 32POS GOLD

    TE Connectivity AMP Connectors

    2,423
    RFQ
    5-1571551-0

    Datenblatt

    500 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    5-1571551-2

    5-1571551-2

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    4,187
    RFQ
    5-1571551-2

    Datenblatt

    500 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    4-1571551-4

    4-1571551-4

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    4,664
    RFQ
    4-1571551-4

    Datenblatt

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    1-1571994-0

    1-1571994-0

    CONN SOCKET SIP 10POS GOLD

    TE Connectivity AMP Connectors

    1,760
    RFQ
    1-1571994-0

    Datenblatt

    510 Tube Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 20.0µin (0.51µm) Copper Thermoplastic, Polyester -
    643648-3

    643648-3

    CONN SOCKET SIP 16POS TIN

    TE Connectivity AMP Connectors

    1,809
    RFQ
    643648-3

    Datenblatt

    Diplomate DL Box Obsolete SIP 16 (1 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
    1825373-4

    1825373-4

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    2,764
    RFQ
    1825373-4

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    2-641611-1

    2-641611-1

    CONN IC DIP SOCKET 18POS TIN

    TE Connectivity AMP Connectors

    3,396
    RFQ
    2-641611-1

    Datenblatt

    Diplomate DL Box Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic -55°C ~ 105°C
    Total 19086 Record«Prev1... 933934935936937938939940...955Next»
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