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    Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
    1825094-3

    1825094-3

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    3,689
    RFQ
    1825094-3

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    8060-1G7

    8060-1G7

    CONN TRANSIST TO-5 3POS GOLD

    TE Connectivity AMP Connectors

    3,256
    RFQ
    8060-1G7

    Datenblatt

    8060 Bulk Active Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    2-1571994-0

    2-1571994-0

    CONN SOCKET SIP 20POS GOLD

    TE Connectivity AMP Connectors

    4,214
    RFQ
    2-1571994-0

    Datenblatt

    510 Tube Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 20.0µin (0.51µm) Copper Thermoplastic, Polyester -
    1825374-3

    1825374-3

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    2,304
    RFQ
    1825374-3

    Datenblatt

    Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    1-822473-1

    1-822473-1

    CONN SOCKET PLCC 20POS TIN

    TE Connectivity AMP Connectors

    1,878
    RFQ
    1-822473-1

    Datenblatt

    - Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
    2-382713-1

    2-382713-1

    CONN IC DIP SOCKET 18POS TIN

    TE Connectivity AMP Connectors

    1,477
    RFQ
    2-382713-1

    Datenblatt

    Diplomate DL Box Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    2-382718-8

    2-382718-8

    CONN IC DIP SOCKET 28POS TIN

    TE Connectivity AMP Connectors

    4,752
    RFQ
    2-382718-8

    Datenblatt

    Diplomate DL Box Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
    2-382724-1

    2-382724-1

    CONN IC DIP SOCKET 40POS TIN

    TE Connectivity AMP Connectors

    2,328
    RFQ
    2-382724-1

    Datenblatt

    Diplomate DL Box Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    1571550-7

    1571550-7

    CONN IC DIP SOCKET 22POS TIN

    TE Connectivity AMP Connectors

    4,387
    RFQ
    1571550-7

    Datenblatt

    500 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    2-1571550-7

    2-1571550-7

    CONN IC DIP SOCKET 22POS GOLD

    TE Connectivity AMP Connectors

    1,952
    RFQ
    2-1571550-7

    Datenblatt

    500 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    3-1571550-0

    3-1571550-0

    CONN IC DIP SOCKET 32POS GOLD

    TE Connectivity AMP Connectors

    3,597
    RFQ
    3-1571550-0

    Datenblatt

    500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    3-1571550-1

    3-1571550-1

    CONN IC DIP SOCKET 36POS GOLD

    TE Connectivity AMP Connectors

    3,132
    RFQ
    3-1571550-1

    Datenblatt

    500 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    506-AG11D-ESL-LF

    506-AG11D-ESL-LF

    CONN IC DIP SOCKET 6POS GOLD

    TE Connectivity AMP Connectors

    3,870
    RFQ
    506-AG11D-ESL-LF

    Datenblatt

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    3-1571551-0

    3-1571551-0

    CONN IC DIP SOCKET 32POS GOLD

    TE Connectivity AMP Connectors

    4,953
    RFQ
    3-1571551-0

    Datenblatt

    500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    5-1571552-1

    5-1571552-1

    CONN IC DIP SOCKET 36POS GOLD

    TE Connectivity AMP Connectors

    4,157
    RFQ
    5-1571552-1

    Datenblatt

    800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    824-AG32D-LF

    824-AG32D-LF

    CONN IC DIP SOCKET 24POS TIN

    TE Connectivity AMP Connectors

    4,927
    RFQ
    824-AG32D-LF

    Datenblatt

    800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    1-1825108-3

    1-1825108-3

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    3,162
    RFQ
    1-1825108-3

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    3-1825276-2

    3-1825276-2

    CONN IC DIP SOCKET 32POS GOLD

    TE Connectivity AMP Connectors

    4,031
    RFQ
    3-1825276-2

    Datenblatt

    Diplomate DL Tray Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    643645-3

    643645-3

    CONN SOCKET SIP 13POS TIN

    TE Connectivity AMP Connectors

    1,670
    RFQ
    643645-3

    Datenblatt

    Diplomate DL Tray Obsolete SIP 13 (1 x 13) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
    510-AG90D-10

    510-AG90D-10

    CONN SOCKET SIP 10POS GOLD

    TE Connectivity AMP Connectors

    3,256
    RFQ
    510-AG90D-10

    Datenblatt

    500 Tube Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold - Beryllium Copper Thermoplastic -
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