Bomkey (HK) Elektronik GmbH!

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    Hersteller Serie Verpackung Produktstatus Typ Gehäuse gekühlt Befestigungsmethode Form Länge Breite Durchmesser Lamellenhöhe Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Gehäuse gekühlt Befestigungsmethode Form Länge Breite Durchmesser Lamellenhöhe Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche
    127687

    127687

    11.578" WIDE X 12" FLATBACK HEAT

    Wakefield-Vette

    2,368
    RFQ
    127687

    Datenblatt

    - Box Active Top Mount, Extrusion - Adhesive Rectangular, Fins 12.000" (304.80mm) 11.578" (294.08mm) - 1.320" (33.53mm) - - 0.21°C/W Aluminum -
    511-12M

    511-12M

    HEATSINK FOR PWR MOD/IGBT/RELAY

    Wakefield-Vette

    4,283
    RFQ
    511-12M

    Datenblatt

    511 Bulk Active Top Mount, Extrusion Power Modules Adhesive Rectangular, Fins 12.000" (304.80mm) 5.210" (132.33mm) - 2.350" (59.69mm) - - 0.45°C/W Aluminum -
    510-12U

    510-12U

    HEATSINK FOR PWR MOD/IGBT/RELAY

    Wakefield-Vette

    1,530
    RFQ
    510-12U

    Datenblatt

    510 Bulk Active Top Mount, Extrusion Power Modules Adhesive Rectangular, Fins 12.000" (304.80mm) 7.380" (187.45mm) - 3.136" (79.65mm) - - 0.24°C/W Aluminum -
    780252F00000G

    780252F00000G

    78025 EXTRUSION 1.24X1.54"X4.1'

    Boyd Laconia, LLC

    2,747
    RFQ
    780252F00000G

    Datenblatt

    - Box Active Board Level, Vertical, Extrusion - PC Pin Rectangular, Pin Fins 49.500" (1257.30mm) 1.535" (39.00mm) - 1.240" (31.50mm) - - - Aluminum -
    510-12M

    510-12M

    HEATSINK FOR PWR MOD/IGBT/RELAY

    Wakefield-Vette

    1,656
    RFQ
    510-12M

    Datenblatt

    510 Bulk Active Top Mount, Extrusion Power Modules Adhesive Rectangular, Fins 12.000" (304.80mm) 7.380" (187.45mm) - 3.106" (78.89mm) - - 0.24°C/W Aluminum -
    783502F00000G

    783502F00000G

    78350 EXTRUSION 3.37X1.95"X4.1'

    Boyd Laconia, LLC

    1,709
    RFQ
    783502F00000G

    Datenblatt

    - Box Active Board Level, Vertical, Extrusion - PC Pin Rectangular, Pin Fins 49.500" (1257.30mm) 1.950" (49.53mm) - 3.366" (85.50mm) - - - Aluminum -
    782202F00000G

    782202F00000G

    78220 EXTRUSION 2.36X1.18"X4.1'

    Boyd Laconia, LLC

    3,190
    RFQ
    782202F00000G

    Datenblatt

    - Box Active Board Level, Vertical, Extrusion - PC Pin Rectangular, Pin Fins 49.500" (1257.30mm) 1.181" (30.00mm) - 2.362" (60.00mm) - 1.50°C/W @ 400 LFM - Aluminum -
    ATS-EXL105-300-R0

    ATS-EXL105-300-R0

    HEATSINK AL6063 300X342X49.5MM

    Advanced Thermal Solutions Inc.

    3,681
    RFQ
    ATS-EXL105-300-R0

    Datenblatt

    - Box Active Top Mount, Extrusion - Adhesive Rectangular, Fins 11.811" (300.00mm) 13.465" (342.00mm) - 1.949" (49.50mm) - 0.59°C/W @ 200 LFM 2.04°C/W Aluminum Degreased
    125460

    125460

    10.78WX12" EXTRUSION XX4559

    Wakefield-Vette

    1,260
    RFQ
    125460

    Datenblatt

    - Box Active Top Mount, Extrusion - Adhesive Rectangular, Fins 12.000" (304.80mm) 10.780" (273.81mm) - 3.770" (95.76mm) - - 0.13°C/W Aluminum -
    688552F00000G

    688552F00000G

    68855 EXTRUSION 0.46X7.201"X4'

    Boyd Laconia, LLC

    3,250
    RFQ
    688552F00000G

    Datenblatt

    - Box Active Top Mount, Extrusion - Adhesive Rectangular 48.000" (1219.20mm) 7.200" (182.88mm) - 0.480" (12.19mm) - 0.50°C/W @ 500 LFM - Aluminum -
    ATS-EXL121-1220-R0

    ATS-EXL121-1220-R0

    PCIE EXTRUSION PROFILE, AL6063

    Advanced Thermal Solutions Inc.

    2,994
    RFQ
    ATS-EXL121-1220-R0

    Datenblatt

    - Bulk Active Top Mount, Extrusion - Adhesive Rectangular, Fins 48.032" (1220.00mm) 2.362" (60.00mm) - 0.551" (14.00mm) - 3.20°C/W @ 200 LFM 16.10°C/W Aluminum Degreased
    627252F00000

    627252F00000

    62725 EXTRUSION 2.28X9.75"X4.62'

    Boyd Laconia, LLC

    2,606
    RFQ
    627252F00000

    Datenblatt

    - Box Active Top Mount, Extrusion - Adhesive Rectangular, Fins 55.500" (1409.70mm) 9.750" (247.65mm) - 2.280" (57.91mm) - 0.20°C/W @ 700 LFM - Aluminum -
    HSS-B20-NP-07

    HSS-B20-NP-07

    HEATSINK TO-220 2.3W ALUMINUM

    Same Sky (Formerly CUI Devices)

    121
    RFQ
    HSS-B20-NP-07

    Datenblatt

    HSS Bag Active Board Level TO-220 - Rectangular, Fins 0.591" (15.00mm) 0.504" (12.80mm) - 0.500" (12.70mm) 2.3W @ 75°C 11.04°C/W @ 200 LFM 33.28°C/W Aluminum Black Anodized
    ATS-PCB1013

    ATS-PCB1013

    HEATSINK TO-220 VERT MNT W/TAB

    Advanced Thermal Solutions Inc.

    396
    RFQ
    ATS-PCB1013

    Datenblatt

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.500" (12.70mm) - 9.50°C/W @ 200 LFM 24.40°C/W Aluminum Black Anodized
    ATS-PCB1044

    ATS-PCB1044

    HEATSINK TO-220 BLACK

    Advanced Thermal Solutions Inc.

    198
    RFQ
    ATS-PCB1044

    Datenblatt

    - Bulk Active Board Level TO-220 - Rectangular, Fins 0.748" (19.00mm) 0.866" (22.00mm) - 0.433" (11.00mm) - 11.20°C/W @ 200 LFM 23.70°C/W Aluminum Black Anodized
    HSS-B20-0508H-01S

    HSS-B20-0508H-01S

    HEATSINK TO-220 4.7W ALUMINUM

    Same Sky (Formerly CUI Devices)

    656
    RFQ
    HSS-B20-0508H-01S

    Datenblatt

    HSS Bag Active Board Level TO-220 Bolt On and Board Mounts Rectangular, Fins 0.500" (12.70mm) 1.000" (25.40mm) - 1.180" (29.97mm) 4.7W @ 75°C 5.87°C/W @ 200 LFM 15.83°C/W Aluminum Black Anodized
    ATS-PCBT1077

    ATS-PCBT1077

    HEATSINK TO-220 BLACK W/TAB

    Advanced Thermal Solutions Inc.

    1,000
    RFQ
    ATS-PCBT1077

    Datenblatt

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) - 7.30°C/W @ 200 LFM 12.50°C/W Aluminum Black Anodized
    V7477WC

    V7477WC

    HEATSINK ALUM ANOD

    Assmann WSW Components

    100
    RFQ
    V7477WC

    Datenblatt

    - Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Bolt On and PC Pin Square, Fins 1.000" (25.40mm) 1.374" (34.90mm) - 0.500" (12.70mm) - - 14.00°C/W Aluminum Black Anodized
    ATS-PCBT1079

    ATS-PCBT1079

    HEATSINK TO-220 VERT BLACK

    Advanced Thermal Solutions Inc.

    892
    RFQ
    ATS-PCBT1079

    Datenblatt

    - Bulk Active Board Level, Vertical TO-220 Bolt On and Board Mounts Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) - 7.10°C/W @ 200 LFM 13.00°C/W Aluminum Black Anodized
    ATS-PCBT1096

    ATS-PCBT1096

    HEATSINK TO-220 STEEL W/TAB

    Advanced Thermal Solutions Inc.

    747
    RFQ
    ATS-PCBT1096

    Datenblatt

    - Bulk Active Board Level, Vertical TO-220 Bolt On and Board Mounts Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.375" (9.52mm) - 14.00°C/W @ 200 LFM 35.70°C/W Steel Tin
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