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    Hersteller Serie Verpackung Produktstatus Typ Gehäuse gekühlt Befestigungsmethode Form Länge Breite Durchmesser Lamellenhöhe Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Gehäuse gekühlt Befestigungsmethode Form Länge Breite Durchmesser Lamellenhöhe Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche
    507302B00000G

    507302B00000G

    HEATSINK TO-220 2.5W LOW PROFILE

    Boyd Laconia, LLC

    31,204
    RFQ
    507302B00000G

    Datenblatt

    - Bulk Active Board Level TO-220 Bolt On Square, Fins 0.750" (19.05mm) 0.750" (19.05mm) - 0.380" (9.65mm) 2.5W @ 60°C 10.00°C/W @ 200 LFM 24.00°C/W Aluminum Black Anodized
    574502B00000G

    574502B00000G

    HEATSINK TO-220 VERT MNT .75"

    Boyd Laconia, LLC

    39,642
    RFQ
    574502B00000G

    Datenblatt

    - Bag Active Board Level TO-220 Clip Rectangular, Fins 0.750" (19.05mm) 0.860" (21.84mm) - 0.395" (10.03mm) 3.0W @ 60°C 8.00°C/W @ 400 LFM 21.20°C/W Aluminum Black Anodized
    290-1AB

    290-1AB

    HEATSINK TO-220 VERT/HORZ BLK

    Wakefield-Vette

    4,488
    RFQ
    290-1AB

    Datenblatt

    290 Bulk Active Board Level TO-218, TO-202, TO-220 Bolt On Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 2.0W @ 44°C 7.00°C/W @ 400 LFM 22.00°C/W Aluminum Black Anodized
    V-1100-SMD/B-L

    V-1100-SMD/B-L

    HEAT SINK COPPER DPAK TO-252

    Assmann WSW Components

    6,405
    RFQ
    V-1100-SMD/B-L

    Datenblatt

    - Bulk Active Top Mount TO-252 (DPak) SMD Pad Rectangular, Fins 0.320" (8.13mm) 0.790" (20.07mm) - 0.390" (9.91mm) - - 25.00°C/W Copper Tin
    V-1100-SMD/A-L

    V-1100-SMD/A-L

    HEATSINK TO-263 12.70X26.20MM

    Assmann WSW Components

    4,987
    RFQ
    V-1100-SMD/A-L

    Datenblatt

    - Bulk Active Top Mount TO-263 (D²Pak) SMD Pad Rectangular, Fins 0.500" (12.70mm) 1.031" (26.20mm) - 0.390" (9.91mm) - - 23.00°C/W Copper Tin
    577102B04000G

    577102B04000G

    HEATSINK TO-220 W/TAB .375"

    Boyd Laconia, LLC

    21,002
    RFQ
    577102B04000G

    Datenblatt

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.375" (9.52mm) 1.0W @ 30°C 8.00°C/W @ 400 LFM 25.90°C/W Aluminum Black Anodized
    V2017B

    V2017B

    HEATSINK ANOD ALUM CPU

    Assmann WSW Components

    3,057
    RFQ
    V2017B

    Datenblatt

    - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) - Square, Pin Fins 0.394" (10.00mm) 0.394" (10.00mm) - 0.275" (7.00mm) - - 31.00°C/W Aluminum Black Anodized
    V6560W

    V6560W

    HEATSINK ALUM ANOD

    Assmann WSW Components

    4,885
    RFQ
    V6560W

    Datenblatt

    - Tray Active Board Level TO-220 Bolt On and PC Pin Rectangular, Fins 0.984" (25.00mm) 1.181" (30.00mm) - 0.472" (12.00mm) - - 10.00°C/W Aluminum Black Anodized
    V-1100-SMD/B

    V-1100-SMD/B

    HEAT SINK COPPER DPAK TO-252

    Assmann WSW Components

    14,896
    RFQ
    V-1100-SMD/B

    Datenblatt

    - Tape & Reel (TR) Active Top Mount TO-252 (DPak) SMD Pad Rectangular, Fins 0.320" (8.13mm) 0.790" (20.07mm) - 0.390" (9.91mm) - - 25.00°C/W Copper Tin
    287-1ABE

    287-1ABE

    HEATSINK FOR TO220

    Wakefield-Vette

    3,947
    RFQ
    287-1ABE

    Datenblatt

    287 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 4.0W @ 65°C 7.80°C/W @ 200 LFM 16.20°C/W Aluminum Black Anodized
    577202B00000G

    577202B00000G

    HEAT SINK TO-220 .500" COMPACT

    Boyd Laconia, LLC

    11,197
    RFQ
    577202B00000G

    Datenblatt

    - Bag Active Board Level TO-220 Bolt On Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.500" (12.70mm) 1.5W @ 40°C 10.00°C/W @ 200 LFM 24.40°C/W Aluminum Black Anodized
    576802B04000G

    576802B04000G

    HEAT SINK VERT PLUG-IN TO-220

    Boyd Laconia, LLC

    12,560
    RFQ
    576802B04000G

    Datenblatt

    - Bulk Active Board Level, Vertical TO-220, TO-262 Clip and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.500" (12.70mm) - 0.500" (12.70mm) 1.0W @ 30°C 7.00°C/W @ 400 LFM 27.30°C/W Aluminum Black Anodized
    577102B00000G

    577102B00000G

    HEAT SINK TO-220 .375" COMPACT

    Boyd Laconia, LLC

    778
    RFQ
    577102B00000G

    Datenblatt

    - Bag Active Board Level TO-220 Bolt On Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.375" (9.52mm) 3.0W @ 80°C 12.00°C/W @ 200 LFM 25.90°C/W Aluminum Black Anodized
    110991327

    110991327

    HEAT SINK KIT FOR RASPBERRY PI 4

    Seeed Technology Co., Ltd

    22,678
    RFQ
    110991327

    Datenblatt

    - Bulk Active Top Mount Kit Raspberry Pi 4B Adhesive - - - - - - - - Aluminum -
    573300D00010G

    573300D00010G

    HEATSINK D2PAK .4" HIGH SMD

    Boyd Laconia, LLC

    21,954
    RFQ
    573300D00010G

    Datenblatt

    - Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) SMD Pad Rectangular, Fins 0.500" (12.70mm) 1.030" (26.16mm) - 0.400" (10.16mm) 1.3W @ 30°C 10.00°C/W @ 200 LFM 18.00°C/W Aluminum Tin
    658-25AB

    658-25AB

    HEATSINK CPU 28MM SQ BLK

    Wakefield-Vette

    10,734
    RFQ
    658-25AB

    Datenblatt

    658 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.250" (6.35mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Aluminum Black Anodized
    HSB05-171711

    HSB05-171711

    HEAT SINK, BGA, 17 X 17 X 11.5 M

    Same Sky (Formerly CUI Devices)

    6,249
    RFQ
    HSB05-171711

    Datenblatt

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.669" (17.00mm) 0.669" (17.00mm) - 0.453" (11.50mm) 3.1W @ 75°C 8.40°C/W @ 200 LFM 23.91°C/W Aluminum Alloy Black Anodized
    574502B03300G

    574502B03300G

    HEATSINK TO-220 VERT MNT W/TAB

    Boyd Laconia, LLC

    8,221
    RFQ
    574502B03300G

    Datenblatt

    - Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.810" (20.57mm) - 0.390" (9.91mm) 3.0W @ 60°C 6.00°C/W @ 600 LFM 21.20°C/W Aluminum Black Anodized
    658-60AB

    658-60AB

    HEATSINK CPU 28MM SQ BLK W/OTAPE

    Wakefield-Vette

    133
    RFQ
    658-60AB

    Datenblatt

    658 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.598" (15.20mm) 2.5W @ 30°C 2.00°C/W @ 500 LFM - Aluminum Black Anodized
    573100D00010G

    573100D00010G

    HEATSINK SMT D-PAK/TO-252 TIN

    Boyd Laconia, LLC

    11,190
    RFQ
    573100D00010G

    Datenblatt

    5731 Tape & Reel (TR) Active Top Mount TO-252 (DPak) SMD Pad Rectangular, Fins 0.315" (8.00mm) 0.900" (22.86mm) - 0.400" (10.16mm) 0.8W @ 30°C 12.50°C/W @ 600 LFM 26.00°C/W Aluminum Tin
    Total 122183 Record«Prev1234...6110Next»
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