Bomkey (HK) Elektronik GmbH!

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    Hersteller Serie Verpackung Produktstatus Typ Gehäuse gekühlt Befestigungsmethode Form Länge Breite Durchmesser Lamellenhöhe Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Gehäuse gekühlt Befestigungsmethode Form Länge Breite Durchmesser Lamellenhöhe Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche
    R2A-CT4-38E

    R2A-CT4-38E

    HEATSINK FOR TO-247

    Ohmite

    1,212
    RFQ
    R2A-CT4-38E

    Datenblatt

    R2 Box Active Board Level TO-247 Clip and PC Pin Rectangular, Fins 1.500" (38.10mm) 1.380" (35.05mm) - 0.870" (22.10mm) 2.0W @ 20°C 1.00°C/W @ 800 LFM 8.60°C/W Aluminum Black Anodized
    542502B00000G

    542502B00000G

    HEATSINK TO-220 TAB BLACK

    Boyd Laconia, LLC

    3,146
    RFQ
    542502B00000G

    Datenblatt

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.250" (31.75mm) 0.875" (22.22mm) - 0.250" (6.35mm) 2.5W @ 60°C 4.00°C/W @ 700 LFM 24.00°C/W Aluminum Black Anodized
    7-340-2PP-BA

    7-340-2PP-BA

    HEATSINK PWR DUAL BLACK TO-220

    CTS Thermal Management Products

    1,400
    RFQ
    7-340-2PP-BA

    Datenblatt

    7 Box Active Board Level TO-220 Bolt On Rectangular, Fins 1.500" (38.10mm) 1.150" (29.21mm) - 0.460" (11.68mm) 9.0W @ 60°C - 6.67°C/W Aluminum Black Anodized
    RA-T2X-51E

    RA-T2X-51E

    HEATSINK TO-218,TO-220,TO-247

    Ohmite

    1,525
    RFQ
    RA-T2X-51E

    Datenblatt

    R Box Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.654" (42.00mm) 0.985" (25.00mm) - 2.000" (50.80mm) 8.0W @ 40°C 1.00°C/W @ 300 LFM 3.50°C/W Aluminum Black Anodized
    ATS-CPX025025015-138-C2-R0

    ATS-CPX025025015-138-C2-R0

    HEATSINK 25X25X15MM L-TAB CP

    Advanced Thermal Solutions Inc.

    1,822
    RFQ
    ATS-CPX025025015-138-C2-R0

    Datenblatt

    pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.590" (15.00mm) - 12.18°C/W @ 100 LFM - Aluminum Blue Anodized
    573400D00010G

    573400D00010G

    HEATSINK D-PAK3 TIN PLATED SMD

    Boyd Laconia, LLC

    2,500
    RFQ
    573400D00010G

    Datenblatt

    - Tape & Reel (TR) Active Top Mount TO-268 (D³Pak) SMD Pad Rectangular, Fins 0.500" (12.70mm) 1.220" (30.99mm) - 0.401" (10.20mm) 1.0W @ 20°C 4.00°C/W @ 600 LFM 14.00°C/W Copper Tin
    590102B03600G

    590102B03600G

    HEATSINK TO-220 W/TABS 1.67"HIGH

    Boyd Laconia, LLC

    5,129
    RFQ
    590102B03600G

    Datenblatt

    - Tray Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.675" (42.55mm) 1.000" (25.40mm) - 1.000" (25.40mm) 2.5W @ 30°C 4.00°C/W @ 300 LFM 10.00°C/W Aluminum Black Anodized
    APF19-19-13CB/A01

    APF19-19-13CB/A01

    HEATSINK FORGED W/ADHESIVE TAPE

    CTS Thermal Management Products

    9,347
    RFQ
    APF19-19-13CB/A01

    Datenblatt

    APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.500" (12.70mm) - 4.00°C/W @ 200 LFM - Aluminum Black Anodized
    573300D00000G

    573300D00000G

    TOP MOUNT HEATSINK .4" D2PAK

    Boyd Laconia, LLC

    1,508
    RFQ
    573300D00000G

    Datenblatt

    - Bulk Active Top Mount TO-263 (D²Pak) SMD Pad Rectangular, Fins 0.500" (12.70mm) 1.030" (26.16mm) - 0.400" (10.16mm) 1.3W @ 30°C 8.00°C/W @ 300 LFM 18.00°C/W Aluminum Tin
    CR101-50AE

    CR101-50AE

    ALUMINUM HEATSINK 50MM BLK ANODI

    Ohmite

    312
    RFQ
    CR101-50AE

    Datenblatt

    CR Box Active Board Level, Vertical TO-101 3 Clips and PC Pin Rectangular, Fins 1.969" (50.00mm) 1.969" (50.00mm) - - - - 5.30°C/W Aluminum Alloy Black Anodized
    C247-025-1AE

    C247-025-1AE

    HEATSINK FOR TO-247 WITH 1 CLIP

    Ohmite

    6,482
    RFQ
    C247-025-1AE

    Datenblatt

    C Box Active Board Level, Vertical TO-247 Clip and PC Pin Rectangular, Fins 0.984" (25.00mm) 1.500" (38.10mm) - 0.710" (18.03mm) 5.0W @ 60°C 6.00°C/W @ 350 LFM - Aluminum Black Anodized
    530102B00150G

    530102B00150G

    HEAT SINK 1.75" HIGH RISE TO-220

    Boyd Laconia, LLC

    2,671
    RFQ
    530102B00150G

    Datenblatt

    - Bulk Active Board Level, Vertical TO-220 Clip and Board Mounts Square, Fins 1.750" (44.45mm) 0.490" (12.44mm) - 1.750" (44.45mm) 4.0W @ 30°C 1.50°C/W @ 400 LFM 6.30°C/W Aluminum Black Anodized
    531302B02500G

    531302B02500G

    HEATSINK TO-220 H=2.5" BLK W/PIN

    Boyd Laconia, LLC

    1,034
    RFQ
    531302B02500G

    Datenblatt

    - Bulk Active Board Level, Vertical TO-220, TO-202 Bolt On and PC Pin Rectangular, Fins 2.500" (63.50mm) 1.375" (34.93mm) - 0.500" (12.70mm) 6.0W @ 40°C 4.00°C/W @ 500 LFM 8.00°C/W Aluminum Black Anodized
    ATS-CPX060060025-132-C2-R0

    ATS-CPX060060025-132-C2-R0

    HEATSINK 60X60X25MM XCUT CP

    Advanced Thermal Solutions Inc.

    5,915
    RFQ
    ATS-CPX060060025-132-C2-R0

    Datenblatt

    pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 2.362" (60.00mm) 2.362" (60.00mm) - 0.984" (25.00mm) - 2.66°C/W @ 100 LFM - Aluminum Blue Anodized
    6030B-TTG

    6030B-TTG

    THM,10594B-TT REV BB(COPPER)G

    Boyd Laconia, LLC

    2,395
    RFQ
    6030B-TTG

    Datenblatt

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) - - - Copper Tin, Black Paint
    530101B00150G

    530101B00150G

    HEATSINK 1.75" HI RISE TO-218

    Boyd Laconia, LLC

    3,446
    RFQ
    530101B00150G

    Datenblatt

    - Bulk Active Board Level, Vertical TO-218 Clip and Board Mounts Square, Fins 1.750" (44.45mm) 0.490" (12.44mm) - 1.750" (44.45mm) 4.0W @ 30°C 1.50°C/W @ 400 LFM 6.30°C/W Aluminum Black Anodized
    D10650-40

    D10650-40

    HEATSINK 100PQFP COMPOSITE

    Wakefield-Vette

    1,145
    RFQ
    D10650-40

    Datenblatt

    Deltem™ Tube Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.650" (16.51mm) 0.650" (16.51mm) - 0.400" (10.16mm) 2.0W @ 40°C 25.00°C/W @ 350 LFM - Composite -
    960-19-12-F-AB-0

    960-19-12-F-AB-0

    HEATSINK 19X12MM FRONT PUSH PIN

    Wakefield-Vette

    119
    RFQ
    960-19-12-F-AB-0

    Datenblatt

    960 Box Active Top Mount BGA Push Pin Square, Pin Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.472" (12.00mm) - 8.60°C/W @ 200 LFM - Aluminum Black Anodized
    518-95AB

    518-95AB

    HEATSINK DC/DC HALF BRICK VERT

    Wakefield-Vette

    2,907
    RFQ
    518-95AB

    Datenblatt

    518 Bulk Active Board Level Half Brick DC/DC Converter Bolt On Rectangular, Fins 2.402" (61.00mm) 2.280" (57.91mm) - 0.950" (24.13mm) 11.0W @ 60°C 2.00°C/W @ 300 LFM - Aluminum Black Anodized
    960-19-15-D-AB-0

    960-19-15-D-AB-0

    HEATSINK 19X15MM DIA PUSH PIN

    Wakefield-Vette

    1,008
    RFQ
    960-19-15-D-AB-0

    Datenblatt

    960 Tray Active Top Mount BGA Push Pin Square, Pin Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.590" (15.00mm) - 6.80°C/W @ 200 LFM - Aluminum Black Anodized
    Total 122183 Record«Prev1234567...6110Next»
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