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    Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
    DIP316-011BLF

    DIP316-011BLF

    CONN IC DIP SOCKET 16POS GOLD

    Amphenol ICC (FCI)

    3,029
    RFQ
    DIP316-011BLF

    Datenblatt

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    DIP324-011BLF

    DIP324-011BLF

    CONN IC DIP SOCKET 24POS GOLD

    Amphenol ICC (FCI)

    4,497
    RFQ
    DIP324-011BLF

    Datenblatt

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    SIP1X20-001BLF

    SIP1X20-001BLF

    CONN SOCKET SIP 20POS GOLD

    Amphenol ICC (FCI)

    4,397
    RFQ
    SIP1X20-001BLF

    Datenblatt

    SIP1x Bulk Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    DIP314-001BLF

    DIP314-001BLF

    CONN IC DIP SOCKET 14POS GOLD

    Amphenol ICC (FCI)

    3,497
    RFQ
    DIP314-001BLF

    Datenblatt

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    DIP324-001BLF

    DIP324-001BLF

    CONN IC DIP SOCKET 24POS GOLD

    Amphenol ICC (FCI)

    3,294
    RFQ
    DIP324-001BLF

    Datenblatt

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    DIP316-001BLF

    DIP316-001BLF

    CONN IC DIP SOCKET 16POS GOLD

    Amphenol ICC (FCI)

    4,980
    RFQ
    DIP316-001BLF

    Datenblatt

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    DIP316-014BLF

    DIP316-014BLF

    CONN IC DIP SOCKET 16POS TIN

    Amphenol ICC (FCI)

    2,017
    RFQ
    DIP316-014BLF

    Datenblatt

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    SIP050-1X04-157BLF

    SIP050-1X04-157BLF

    CONN SOCKET SIP 4POS TIN

    Amphenol ICC (FCI)

    2,144
    RFQ
    SIP050-1X04-157BLF

    Datenblatt

    SIP050-1x Bulk Obsolete SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    SIP050-1X27-157BLF

    SIP050-1X27-157BLF

    CONN SOCKET SIP 27POS TIN

    Amphenol ICC (FCI)

    3,672
    RFQ
    SIP050-1X27-157BLF

    Datenblatt

    SIP050-1x Bulk Obsolete SIP 27 (1 x 27) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    SIP1X20-041BLF

    SIP1X20-041BLF

    CONN SOCKET SIP 20POS GOLD

    Amphenol ICC (FCI)

    2,930
    RFQ
    SIP1X20-041BLF

    Datenblatt

    SIP1x Bulk Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    DIP628-014BLF

    DIP628-014BLF

    CONN IC DIP SOCKET 28POS TIN

    Amphenol ICC (FCI)

    2,631
    RFQ
    DIP628-014BLF

    Datenblatt

    - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    SIP050-1X18-157BLF

    SIP050-1X18-157BLF

    CONN SOCKET SIP 18POS TIN

    Amphenol ICC (FCI)

    3,369
    RFQ
    SIP050-1X18-157BLF

    Datenblatt

    SIP050-1x Bulk Obsolete SIP 18 (1 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    DIP306-001BLF

    DIP306-001BLF

    CONN IC DIP SOCKET 6POS GOLD

    Amphenol ICC (FCI)

    3,949
    RFQ
    DIP306-001BLF

    Datenblatt

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    SIP050-1X02-157BLF

    SIP050-1X02-157BLF

    CONN SOCKET SIP 2POS TIN

    Amphenol ICC (FCI)

    4,640
    RFQ
    SIP050-1X02-157BLF

    Datenblatt

    SIP050-1x Bulk Obsolete SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    SIP050-1X04-160BLF

    SIP050-1X04-160BLF

    CONN SOCKET SIP 4POS GOLD

    Amphenol ICC (FCI)

    2,353
    RFQ
    SIP050-1X04-160BLF

    Datenblatt

    SIP050-1x Bulk Obsolete SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    SIP050-1X14-160BLF

    SIP050-1X14-160BLF

    CONN SOCKET SIP 14POS GOLD

    Amphenol ICC (FCI)

    4,845
    RFQ
    SIP050-1X14-160BLF

    Datenblatt

    SIP050-1x Bulk Obsolete SIP 14 (1 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    SIP1X32-041BLF

    SIP1X32-041BLF

    CONN SOCKET SIP 32POS GOLD

    Amphenol ICC (FCI)

    4,166
    RFQ
    SIP1X32-041BLF

    Datenblatt

    SIP1x Bulk Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP050-1X05-157BLF

    SIP050-1X05-157BLF

    CONN SOCKET SIP 5POS TIN

    Amphenol ICC (FCI)

    1,296
    RFQ
    SIP050-1X05-157BLF

    Datenblatt

    SIP050-1x Bulk Obsolete SIP 5 (1 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    SIP050-1X20-160BLF

    SIP050-1X20-160BLF

    CONN SOCKET SIP 20POS GOLD

    Amphenol ICC (FCI)

    4,982
    RFQ
    SIP050-1X20-160BLF

    Datenblatt

    SIP050-1x Bulk Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    SIP050-1X02-160BLF

    SIP050-1X02-160BLF

    1X02-160BLF SIP SOCKET 2 CTS

    Amphenol ICC (FCI)

    4,024
    RFQ
    SIP050-1X02-160BLF

    Datenblatt

    SIP050-1x Bulk Obsolete SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    Total 19086 Record«Prev1... 927928929930931932933934...955Next»
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