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    Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
    SIP1X15-011BLF

    SIP1X15-011BLF

    CONN SOCKET SIP 15POS GOLD

    Amphenol ICC (FCI)

    1,984
    RFQ
    SIP1X15-011BLF

    Datenblatt

    SIP1x Bulk Obsolete SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP1X08-014BLF

    SIP1X08-014BLF

    CONN SOCKET SIP 8POS TIN

    Amphenol ICC (FCI)

    4,430
    RFQ
    SIP1X08-014BLF

    Datenblatt

    SIP1x Bulk Obsolete SIP 8 (1 x 8) 0.100" (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP1X27-001BLF

    SIP1X27-001BLF

    CONN SOCKET SIP 27POS GOLD

    Amphenol ICC (FCI)

    3,197
    RFQ
    SIP1X27-001BLF

    Datenblatt

    SIP1x Bulk Obsolete SIP 27 (1 x 27) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP1X12-011BLF

    SIP1X12-011BLF

    CONN SOCKET SIP 12POS GOLD

    Amphenol ICC (FCI)

    1,695
    RFQ
    SIP1X12-011BLF

    Datenblatt

    SIP1x Bulk Obsolete SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP1X32-001BLF

    SIP1X32-001BLF

    CONN SOCKET SIP 32POS GOLD

    Amphenol ICC (FCI)

    1,885
    RFQ
    SIP1X32-001BLF

    Datenblatt

    SIP1x Bulk Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP1X02-011BLF

    SIP1X02-011BLF

    CONN SOCKET SIP 2POS GOLD

    Amphenol ICC (FCI)

    3,340
    RFQ
    SIP1X02-011BLF

    Datenblatt

    SIP1x Bulk Obsolete SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP1X11-011BLF

    SIP1X11-011BLF

    CONN SOCKET SIP 11POS GOLD

    Amphenol ICC (FCI)

    2,048
    RFQ
    SIP1X11-011BLF

    Datenblatt

    SIP1x Bulk Obsolete SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    DIP632-001BLF

    DIP632-001BLF

    CONN IC DIP SOCKET 32POS GOLD

    Amphenol ICC (FCI)

    3,219
    RFQ
    DIP632-001BLF

    Datenblatt

    - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    DIP628-001BLF

    DIP628-001BLF

    CONN IC DIP SOCKET 28POS GOLD

    Amphenol ICC (FCI)

    4,951
    RFQ
    DIP628-001BLF

    Datenblatt

    - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    SIP1X20-011BLF

    SIP1X20-011BLF

    CONN SOCKET SIP 20POS GOLD

    Amphenol ICC (FCI)

    2,099
    RFQ
    SIP1X20-011BLF

    Datenblatt

    SIP1x Bulk Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    DIP640-001BLF

    DIP640-001BLF

    CONN IC DIP SOCKET 40POS GOLD

    Amphenol ICC (FCI)

    2,642
    RFQ
    DIP640-001BLF

    Datenblatt

    - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    SIP1X16-011BLF

    SIP1X16-011BLF

    CONN SOCKET SIP 16POS GOLD

    Amphenol ICC (FCI)

    1,912
    RFQ
    SIP1X16-011BLF

    Datenblatt

    SIP1x Bulk Obsolete SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP1X10-001BLF

    SIP1X10-001BLF

    CONN SOCKET SIP 10POS GOLD

    Amphenol ICC (FCI)

    4,637
    RFQ
    SIP1X10-001BLF

    Datenblatt

    SIP1x Bulk Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP1X13-001BLF

    SIP1X13-001BLF

    SIP1X13-001BLF SIP SOCKET 13 CTS

    Amphenol ICC (FCI)

    4,450
    RFQ
    SIP1X13-001BLF

    Datenblatt

    SIP1x Bulk Obsolete SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP1X02-001BLF

    SIP1X02-001BLF

    CONN SOCKET SIP 2POS GOLD

    Amphenol ICC (FCI)

    3,337
    RFQ
    SIP1X02-001BLF

    Datenblatt

    SIP1x Bulk Obsolete SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    SIP1X17-001BLF

    SIP1X17-001BLF

    CONN SOCKET SIP 17POS GOLD

    Amphenol ICC (FCI)

    2,337
    RFQ
    SIP1X17-001BLF

    Datenblatt

    SIP1x Bulk Obsolete SIP 17 (1 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    DIP328-014BLF

    DIP328-014BLF

    CONN IC DIP SOCKET 28POS TIN

    Amphenol ICC (FCI)

    4,675
    RFQ
    DIP328-014BLF

    Datenblatt

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    DIP324-014BLF

    DIP324-014BLF

    CONN IC DIP SOCKET 24POS TIN

    Amphenol ICC (FCI)

    3,364
    RFQ
    DIP324-014BLF

    Datenblatt

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    DIP328-011BLF

    DIP328-011BLF

    CONN IC DIP SOCKET 28POS GOLD

    Amphenol ICC (FCI)

    1,795
    RFQ
    DIP328-011BLF

    Datenblatt

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    DIP318-011BLF

    DIP318-011BLF

    CONN IC DIP SOCKET 18POS GOLD

    Amphenol ICC (FCI)

    1,882
    RFQ
    DIP318-011BLF

    Datenblatt

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    Total 19086 Record«Prev1... 926927928929930931932933...955Next»
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