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    Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
    1825093-5

    1825093-5

    CONN IC DIP SOCKET 18POS GOLD

    TE Connectivity AMP Connectors

    2,752
    RFQ
    1825093-5

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    1825093-6

    1825093-6

    CONN IC DIP SOCKET 20POS GOLD

    TE Connectivity AMP Connectors

    3,933
    RFQ
    1825093-6

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    1825108-2

    1825108-2

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    2,410
    RFQ
    1825108-2

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    1825109-2

    1825109-2

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    3,252
    RFQ
    1825109-2

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    1825108-3

    1825108-3

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    4,031
    RFQ
    1825108-3

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    1-1825093-2

    1-1825093-2

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    1,398
    RFQ
    1-1825093-2

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    1-1825109-2

    1-1825109-2

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    1,898
    RFQ
    1-1825109-2

    Datenblatt

    Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    1-1825276-2

    1-1825276-2

    CONN IC DIP SOCKET 32POS GOLD

    TE Connectivity AMP Connectors

    4,294
    RFQ
    1-1825276-2

    Datenblatt

    Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    1-1825109-3

    1-1825109-3

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    2,780
    RFQ
    1-1825109-3

    Datenblatt

    Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    1825373-2

    1825373-2

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    4,016
    RFQ
    1825373-2

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    1-1825093-4

    1-1825093-4

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    2,740
    RFQ
    1-1825093-4

    Datenblatt

    Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    1-1825108-2

    1-1825108-2

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    4,655
    RFQ
    1-1825108-2

    Datenblatt

    Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    1-390261-2

    1-390261-2

    CONN IC DIP SOCKET 8POS TIN

    TE Connectivity AMP Connectors

    2,053
    RFQ
    1-390261-2

    Datenblatt

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
    1-390261-3

    1-390261-3

    CONN IC DIP SOCKET 14POS TIN

    TE Connectivity AMP Connectors

    3,301
    RFQ
    1-390261-3

    Datenblatt

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
    1-390261-4

    1-390261-4

    CONN IC DIP SOCKET 16POS TIN

    TE Connectivity AMP Connectors

    1,348
    RFQ
    1-390261-4

    Datenblatt

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
    1-390262-2

    1-390262-2

    CONN IC DIP SOCKET 28POS TIN

    TE Connectivity AMP Connectors

    3,837
    RFQ
    1-390262-2

    Datenblatt

    - Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole, Right Angle, Vertical Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze - -40°C ~ 105°C
    2-641266-1

    2-641266-1

    CONN IC DIP SOCKET 24POS TIN

    TE Connectivity AMP Connectors

    2,143
    RFQ
    2-641266-1

    Datenblatt

    Diplomate DL Box Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic -55°C ~ 105°C
    218-7223-55-1902

    218-7223-55-1902

    CONN SOCKET SOIC 18POS GOLD

    3M

    2,205
    RFQ
    218-7223-55-1902

    Datenblatt

    Textool™ Bulk Active SOIC 18 (2 x 9) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
    200-6310-9UN-1900

    200-6310-9UN-1900

    CONN SOCKET PGA ZIF 100POS GOLD

    3M

    3,594
    RFQ
    200-6310-9UN-1900

    Datenblatt

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 100 (10 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    200-6311-9UN-1900

    200-6311-9UN-1900

    CONN SOCKET PGA ZIF 121POS GOLD

    3M

    2,358
    RFQ
    200-6311-9UN-1900

    Datenblatt

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 121 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    Total 19086 Record«Prev1... 921922923924925926927928...955Next»
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