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    Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
    2-641261-1

    2-641261-1

    CONN IC DIP SOCKET 14POS TIN

    TE Connectivity AMP Connectors

    3,132
    RFQ
    2-641261-1

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    2-641260-1

    2-641260-1

    CONN IC DIP SOCKET 8POS TIN

    TE Connectivity AMP Connectors

    1,729
    RFQ
    2-641260-1

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    2-641260-4

    2-641260-4

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    2,251
    RFQ
    2-641260-4

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    2-641262-1

    2-641262-1

    CONN IC DIP SOCKET 16POS TIN

    TE Connectivity AMP Connectors

    1,066
    RFQ
    2-641262-1

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    2-640464-2

    2-640464-2

    CONN IC DIP SOCKET 20POS GOLD

    TE Connectivity AMP Connectors

    1,581
    RFQ
    2-640464-2

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
    2-640362-2

    2-640362-2

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    3,704
    RFQ
    2-640362-2

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    2-640463-2

    2-640463-2

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    4,781
    RFQ
    2-640463-2

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    2-641267-3

    2-641267-3

    CONN IC DIP SOCKET 28POS TIN

    TE Connectivity AMP Connectors

    3,792
    RFQ
    2-641267-3

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
    2-641615-1

    2-641615-1

    CONN IC DIP SOCKET 28POS TIN

    TE Connectivity AMP Connectors

    3,616
    RFQ
    2-641615-1

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    2-641606-2

    2-641606-2

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    1,708
    RFQ
    2-641606-2

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    2-641609-1

    2-641609-1

    CONN IC DIP SOCKET 14POS TIN

    TE Connectivity AMP Connectors

    4,689
    RFQ
    2-641609-1

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    2-641610-1

    2-641610-1

    CONN IC DIP SOCKET 16POS TIN

    TE Connectivity AMP Connectors

    1,323
    RFQ
    2-641610-1

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper - -
    2-641605-2

    2-641605-2

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    3,550
    RFQ
    2-641605-2

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    2-641612-1

    2-641612-1

    CONN IC DIP SOCKET 20POS TIN

    TE Connectivity AMP Connectors

    4,781
    RFQ
    2-641612-1

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic -55°C ~ 105°C
    2-641605-4

    2-641605-4

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    4,255
    RFQ
    2-641605-4

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    2-641268-1

    2-641268-1

    CONN IC DIP SOCKET 40POS TIN

    TE Connectivity AMP Connectors

    1,930
    RFQ
    2-641268-1

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    2-641296-2

    2-641296-2

    CONN IC DIP SOCKET 6POS GOLD

    TE Connectivity AMP Connectors

    3,889
    RFQ
    2-641296-2

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    2-641599-2

    2-641599-2

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    4,655
    RFQ
    2-641599-2

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    2-641600-2

    2-641600-2

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    2,606
    RFQ
    2-641600-2

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    2-641600-4

    2-641600-4

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    2,066
    RFQ
    2-641600-4

    Datenblatt

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
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