Bomkey (HK) Elektronik GmbH!

    IC-Sockel

    Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

    Alle zurücksetzen
    Alle anwenden
    Ergebnis
    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
    299-PRS20009-12

    299-PRS20009-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,164
    RFQ
    299-PRS20009-12

    Datenblatt

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    225-PRS15001-16

    225-PRS15001-16

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,520
    RFQ
    225-PRS15001-16

    Datenblatt

    PRS Bulk Obsolete PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 200°C
    1023-2-0324-0B-01

    1023-2-0324-0B-01

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    1,108
    RFQ
    1023-2-0324-0B-01

    Datenblatt

    - Bulk Active - - - - - - - - - - - - - - -
    256-5205-01

    256-5205-01

    3M TEXTOOL 256-5205-01 QFN .5 MM

    3M

    2,980
    RFQ
    256-5205-01

    Datenblatt

    Textool™ Bulk Active - - - - - - - - - - - - - - -
    268-4204-00

    268-4204-00

    3M TEXTOOL 268-4204-00 QFN.4 MM

    3M

    2,578
    RFQ
    268-4204-00

    Datenblatt

    Textool™ Bulk Active - - - - - - - - - - - - - - -
    216-PLS21016-12

    216-PLS21016-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,949
    RFQ
    216-PLS21016-12

    Datenblatt

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    7100236450

    7100236450

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    2,011
    RFQ
    7100236450

    Datenblatt

    - Bulk Active - - - - - - - - - - - - - - -
    36-3574-18

    36-3574-18

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    4,208
    RFQ
    36-3574-18

    Datenblatt

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6574-18

    36-6574-18

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    2,006
    RFQ
    36-6574-18

    Datenblatt

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6575-18

    36-6575-18

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    4,409
    RFQ
    36-6575-18

    Datenblatt

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    336-PRS21022-12

    336-PRS21022-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,025
    RFQ
    336-PRS21022-12

    Datenblatt

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    281-PLS19012-12

    281-PLS19012-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,899
    RFQ
    281-PLS19012-12

    Datenblatt

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    240-PRS20014-12

    240-PRS20014-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,420
    RFQ
    240-PRS20014-12

    Datenblatt

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    40-3574-18

    40-3574-18

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    4,405
    RFQ
    40-3574-18

    Datenblatt

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6574-18

    40-6574-18

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    1,764
    RFQ
    40-6574-18

    Datenblatt

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    273-PRS21004-12

    273-PRS21004-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,608
    RFQ
    273-PRS21004-12

    Datenblatt

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    7100265147

    7100265147

    TEXTOOLBURN-IN GRID ZIP SOCKETS

    3M

    2,746
    RFQ
    7100265147

    Datenblatt

    Textool™ Bulk Active PGA, ZIF (ZIP) 132 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    256-PRS20005-12

    256-PRS20005-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,909
    RFQ
    256-PRS20005-12

    Datenblatt

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    257-PLS20013-12

    257-PLS20013-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,307
    RFQ
    257-PLS20013-12

    Datenblatt

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    257-PRS20013-12

    257-PRS20013-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,809
    RFQ
    257-PRS20013-12

    Datenblatt

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    Total 19086 Record«Prev1... 911912913914915916917918...955Next»
    Kontaktieren Sie uns Mehr Produktinformationen erhalten!
    BomKey Elektronik

    Startseite

    BomKey Elektronik

    Produkte

    BomKey Elektronik

    Telefon

    BomKey Elektronik

    Benutzer

    Günstige Preise jeden Tag, sorgenfreie Auswahl.
    Günstige Preise jeden Tag, sorgenfreie Auswahl.
    Echte lizenzierte Waren, exzellenter Service.
    Echte lizenzierte Waren, exzellenter Service.
    Direktlieferung aus mehreren Lagern, schnelle Lieferung.
    Direktlieferung aus mehreren Lagern, schnelle Lieferung.
    Vollständige Produktpalette für einfaches Einkaufen.
    Vollständige Produktpalette für einfaches Einkaufen.
    Copyright © 2025 Bomkey Elektronik. Alle Rechte vorbehalten