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    Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
    7100148803

    7100148803

    TEXTOOL1012-0-0289-0B-00L20 0.65

    3M

    3,832
    RFQ
    7100148803

    Datenblatt

    - Bulk Active - - - - - - - - - - - - - - -
    192-PRS17027-12

    192-PRS17027-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,737
    RFQ
    192-PRS17027-12

    Datenblatt

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    7010402522

    7010402522

    TEXTOOLTEST & BURN-IN SOCKETS PL

    3M

    1,189
    RFQ
    7010402522

    Datenblatt

    - Bulk Active - - - - - - - - - - - - - - -
    244-5205-00

    244-5205-00

    3M TEXTOOL OPEN-TOP SOCKETS FOR

    3M

    4,734
    RFQ
    244-5205-00

    Datenblatt

    Textool™ Box Active - - - - - - - - - - - - - - -
    216-PRS21016-12

    216-PRS21016-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,102
    RFQ
    216-PRS21016-12

    Datenblatt

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    208-PLS17017-12

    208-PLS17017-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,312
    RFQ
    208-PLS17017-12

    Datenblatt

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    32-3574-18

    32-3574-18

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    3,253
    RFQ
    32-3574-18

    Datenblatt

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    32-6574-18

    32-6574-18

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    2,329
    RFQ
    32-6574-18

    Datenblatt

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    209-PRS17030-12

    209-PRS17030-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,889
    RFQ
    209-PRS17030-12

    Datenblatt

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    209-PRS17046-12

    209-PRS17046-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,456
    RFQ
    209-PRS17046-12

    Datenblatt

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    176-PRS15014-12

    176-PRS15014-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,615
    RFQ
    176-PRS15014-12

    Datenblatt

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    280-PLS19006-12

    280-PLS19006-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,707
    RFQ
    280-PLS19006-12

    Datenblatt

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    280-PRS19006-12

    280-PRS19006-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,690
    RFQ
    280-PRS19006-12

    Datenblatt

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    281-PRS19012-12

    281-PRS19012-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,330
    RFQ
    281-PRS19012-12

    Datenblatt

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    179-PLS18038-12

    179-PLS18038-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,581
    RFQ
    179-PLS18038-12

    Datenblatt

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    179-PRS18038-12

    179-PRS18038-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,913
    RFQ
    179-PRS18038-12

    Datenblatt

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    281-PRS18037-12

    281-PRS18037-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,825
    RFQ
    281-PRS18037-12

    Datenblatt

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    32-3575-18

    32-3575-18

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    1,386
    RFQ
    32-3575-18

    Datenblatt

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    32-6575-18

    32-6575-18

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    2,456
    RFQ
    32-6575-18

    Datenblatt

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    180-PLS18007-12

    180-PLS18007-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,122
    RFQ
    180-PLS18007-12

    Datenblatt

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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