Bomkey (HK) Elektronik GmbH!

    IC-Sockel

    Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

    Alle zurücksetzen
    Alle anwenden
    Ergebnis
    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
    210-43-632-41-001000

    210-43-632-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    204
    RFQ
    210-43-632-41-001000

    Datenblatt

    210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-640-41-001000

    110-41-640-41-001000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    432
    RFQ
    110-41-640-41-001000

    Datenblatt

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-328-41-001000

    115-93-328-41-001000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    339
    RFQ
    115-93-328-41-001000

    Datenblatt

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-93-314-41-001000

    123-93-314-41-001000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    181
    RFQ
    123-93-314-41-001000

    Datenblatt

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    D2840-42

    D2840-42

    CONN IC DIP SOCKET 40POS GOLD

    Harwin Inc.

    318
    RFQ
    D2840-42

    Datenblatt

    D2 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
    4513

    4513

    CONN TRANSIST TO-3 3POS TIN

    Keystone Electronics

    2,238
    RFQ
    4513

    Datenblatt

    - Bulk Active Transistor, TO-3 3 (Oval) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polybutylene Terephthalate (PBT) -
    940-44-084-17-400000

    940-44-084-17-400000

    CONN SOCKET PLCC 84POS TIN

    Mill-Max Manufacturing Corp.

    212
    RFQ
    940-44-084-17-400000

    Datenblatt

    940 Tube Active PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-324-41-001000

    110-13-324-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    1,275
    RFQ
    110-13-324-41-001000

    Datenblatt

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-640-41-001000

    110-43-640-41-001000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    579
    RFQ
    110-43-640-41-001000

    Datenblatt

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-43-640-41-001000

    210-43-640-41-001000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    265
    RFQ
    210-43-640-41-001000

    Datenblatt

    210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-93-310-11-001000

    299-93-310-11-001000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    213
    RFQ
    299-93-310-11-001000

    Datenblatt

    299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-43-310-11-001000

    299-43-310-11-001000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    248
    RFQ
    299-43-310-11-001000

    Datenblatt

    299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    D01-9952042

    D01-9952042

    CONN SOCKET SIP 20POS GOLD

    Harwin Inc.

    357
    RFQ
    D01-9952042

    Datenblatt

    D01-995 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    20-0511-10

    20-0511-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    2,704
    RFQ
    20-0511-10

    Datenblatt

    511 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-13-328-41-001000

    110-13-328-41-001000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    212
    RFQ
    110-13-328-41-001000

    Datenblatt

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    540-44-044-17-400000

    540-44-044-17-400000

    CONN SOCKET PLCC 44POS TIN

    Mill-Max Manufacturing Corp.

    687
    RFQ
    540-44-044-17-400000

    Datenblatt

    540 Tube Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
    110-44-964-41-001000

    110-44-964-41-001000

    CONN IC DIP SOCKET 64POS TIN

    Mill-Max Manufacturing Corp.

    154
    RFQ
    110-44-964-41-001000

    Datenblatt

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-93-310-10-001000

    299-93-310-10-001000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    114
    RFQ
    299-93-310-10-001000

    Datenblatt

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-93-320-41-001000

    123-93-320-41-001000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    199
    RFQ
    123-93-320-41-001000

    Datenblatt

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-43-312-11-001000

    299-43-312-11-001000

    CONN IC DIP SOCKET 12POS GOLD

    Mill-Max Manufacturing Corp.

    180
    RFQ
    299-43-312-11-001000

    Datenblatt

    299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 1516171819202122...955Next»
    Kontaktieren Sie uns Mehr Produktinformationen erhalten!
    BomKey Elektronik

    Startseite

    BomKey Elektronik

    Produkte

    BomKey Elektronik

    Telefon

    BomKey Elektronik

    Benutzer

    Günstige Preise jeden Tag, sorgenfreie Auswahl.
    Günstige Preise jeden Tag, sorgenfreie Auswahl.
    Echte lizenzierte Waren, exzellenter Service.
    Echte lizenzierte Waren, exzellenter Service.
    Direktlieferung aus mehreren Lagern, schnelle Lieferung.
    Direktlieferung aus mehreren Lagern, schnelle Lieferung.
    Vollständige Produktpalette für einfaches Einkaufen.
    Vollständige Produktpalette für einfaches Einkaufen.
    Copyright © 2025 Bomkey Elektronik. Alle Rechte vorbehalten