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    Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
    PLCC-52-AT

    PLCC-52-AT

    PLCC 52P THROUGH HOLE

    Adam Tech

    1,872
    RFQ
    PLCC-52-AT

    Datenblatt

    PLCC Tube Active PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 80.0µin (2.03µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    940-44-028-17-400000

    940-44-028-17-400000

    CONN SOCKET PLCC 28POS TIN

    Mill-Max Manufacturing Corp.

    887
    RFQ
    940-44-028-17-400000

    Datenblatt

    940 Tube Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-316-41-001000

    110-41-316-41-001000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    836
    RFQ
    110-41-316-41-001000

    Datenblatt

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    AR 28-HZL/01/7-TT

    AR 28-HZL/01/7-TT

    CONN IC DIP SOCKET 28POS GOLD

    Assmann WSW Components

    5,267
    RFQ
    AR 28-HZL/01/7-TT

    Datenblatt

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    110-47-316-41-105000

    110-47-316-41-105000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    395
    RFQ
    110-47-316-41-105000

    Datenblatt

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    PLCC-84-AT-SMT

    PLCC-84-AT-SMT

    PLCC SOCKET 84P SMT

    Adam Tech

    183
    RFQ
    PLCC-84-AT-SMT

    Datenblatt

    PLCC Tube Active PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    110-99-328-41-001000

    110-99-328-41-001000

    CONN IC DIP SOCKET 28POS TINLEAD

    Mill-Max Manufacturing Corp.

    808
    RFQ
    110-99-328-41-001000

    Datenblatt

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-43-314-41-001000

    210-43-314-41-001000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    427
    RFQ
    210-43-314-41-001000

    Datenblatt

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-99-628-41-001000

    110-99-628-41-001000

    CONN IC DIP SOCKET 28POS TINLEAD

    Mill-Max Manufacturing Corp.

    405
    RFQ
    110-99-628-41-001000

    Datenblatt

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    8428-21B1-RK-TR

    8428-21B1-RK-TR

    CONN SOCKET PLCC 28POS TIN

    3M

    2,750
    RFQ
    8428-21B1-RK-TR

    Datenblatt

    8400 Tape & Reel (TR) Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    214-44-316-01-670800

    214-44-316-01-670800

    CONN IC DIP SOCKET 16POS TIN

    Mill-Max Manufacturing Corp.

    101
    RFQ
    214-44-316-01-670800

    Datenblatt

    214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    D0808-42

    D0808-42

    CONN IC DIP SOCKET 8POS GOLD

    Harwin Inc.

    2,547
    RFQ
    D0808-42

    Datenblatt

    D0 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-87-314-41-001101

    123-87-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    672
    RFQ
    123-87-314-41-001101

    Datenblatt

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    917-93-103-41-005000

    917-93-103-41-005000

    CONN TRANSIST TO-5 3POS GOLD

    Mill-Max Manufacturing Corp.

    306
    RFQ
    917-93-103-41-005000

    Datenblatt

    917 Tube Active Transistor, TO-5 3 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    8444-21A1-RK-TP

    8444-21A1-RK-TP

    CONN SOCKET PLCC 44POS TIN

    3M

    216
    RFQ
    8444-21A1-RK-TP

    Datenblatt

    8400 Tube Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    110-41-318-41-001000

    110-41-318-41-001000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    516
    RFQ
    110-41-318-41-001000

    Datenblatt

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-47-628-41-001000

    110-47-628-41-001000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    329
    RFQ
    110-47-628-41-001000

    Datenblatt

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    AR 28-HZL-TT

    AR 28-HZL-TT

    CONN IC DIP SOCKET 28POS TIN

    Assmann WSW Components

    2,066
    RFQ
    AR 28-HZL-TT

    Datenblatt

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    917-43-104-41-005000

    917-43-104-41-005000

    CONN TRANSIST TO-5 4POS GOLD

    Mill-Max Manufacturing Corp.

    466
    RFQ
    917-43-104-41-005000

    Datenblatt

    917 Tube Active Transistor, TO-5 4 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-93-104-41-005000

    917-93-104-41-005000

    CONN TRANSIST TO-5 4POS GOLD

    Mill-Max Manufacturing Corp.

    323
    RFQ
    917-93-104-41-005000

    Datenblatt

    917 Tube Active Transistor, TO-5 4 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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