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    Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
    110-87-318-41-001101

    110-87-318-41-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    247
    RFQ
    110-87-318-41-001101

    Datenblatt

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    08-4513-10

    08-4513-10

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    1,650
    RFQ
    08-4513-10

    Datenblatt

    Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-2513-10

    08-2513-10

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    293
    RFQ
    08-2513-10

    Datenblatt

    Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-3518-10

    16-3518-10

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    243
    RFQ
    16-3518-10

    Datenblatt

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-99-320-41-001000

    110-99-320-41-001000

    CONN IC DIP SOCKET 20POS TINLEAD

    Mill-Max Manufacturing Corp.

    1,808
    RFQ
    110-99-320-41-001000

    Datenblatt

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-47-103-41-005000

    917-47-103-41-005000

    CONN SOCKET TRANSIST TO-5 3POS

    Mill-Max Manufacturing Corp.

    711
    RFQ
    917-47-103-41-005000

    Datenblatt

    917 Tube Active Transistor, TO-5 3 (Round) - Gold Flash Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-44-320-41-001000

    110-44-320-41-001000

    CONN IC DIP SOCKET 20POS TIN

    Mill-Max Manufacturing Corp.

    489
    RFQ
    110-44-320-41-001000

    Datenblatt

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    AR 16-HZL/01-TT

    AR 16-HZL/01-TT

    CONN IC DIP SOCKET 16POS GOLD

    Assmann WSW Components

    5,069
    RFQ
    AR 16-HZL/01-TT

    Datenblatt

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    SA286040

    SA286040

    CONN IC DIP SOCKET 28POS GOLD

    On Shore Technology Inc.

    500
    RFQ
    SA286040

    Datenblatt

    SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 80.0µin (2.03µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    SA283040

    SA283040

    CONN IC DIP SOCKET 28POS GOLD

    On Shore Technology Inc.

    129
    RFQ
    SA283040

    Datenblatt

    SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 80.0µin (2.03µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    SA326000

    SA326000

    CONN IC DIP SOCKET 32POS GOLD

    On Shore Technology Inc.

    237
    RFQ
    SA326000

    Datenblatt

    SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    115-43-308-41-003000

    115-43-308-41-003000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    995
    RFQ
    115-43-308-41-003000

    Datenblatt

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    PLCC-84-AT

    PLCC-84-AT

    PLCC 84P THROUGH HOLE

    Adam Tech

    522
    RFQ
    PLCC-84-AT

    Datenblatt

    PLCC Tube Active PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 80.0µin (2.03µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    ICM-640-1-GT-HT

    ICM-640-1-GT-HT

    MACHINE PIN SOCKET, IC, DIP, 40P

    Adam Tech

    217
    RFQ
    ICM-640-1-GT-HT

    Datenblatt

    ICM Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
    917-47-104-41-005000

    917-47-104-41-005000

    CONN SOCKET TRANSIST TO-5 4POS

    Mill-Max Manufacturing Corp.

    804
    RFQ
    917-47-104-41-005000

    Datenblatt

    917 Tube Active Transistor, TO-5 4 (Round) - Gold Flash Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-87-318-41-134161

    114-87-318-41-134161

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    495
    RFQ
    114-87-318-41-134161

    Datenblatt

    114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-47-320-41-001000

    110-47-320-41-001000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    584
    RFQ
    110-47-320-41-001000

    Datenblatt

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-308-41-001000

    111-93-308-41-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    2,149
    RFQ
    111-93-308-41-001000

    Datenblatt

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    D2814-42

    D2814-42

    CONN IC DIP SOCKET 14POS GOLD

    Harwin Inc.

    16,792
    RFQ
    D2814-42

    Datenblatt

    D2 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
    8420-11B1-RK-TP

    8420-11B1-RK-TP

    CONN SOCKET PLCC 20POS TIN

    3M

    1,048
    RFQ
    8420-11B1-RK-TP

    Datenblatt

    8400 Tube Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
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