Bomkey (HK) Elektronik GmbH!

    Kühlkörper

    Hersteller Serie Verpackung Produktstatus Typ Gehäuse gekühlt Befestigungsmethode Form Länge Breite Durchmesser Lamellenhöhe Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche

    Alle zurücksetzen
    Alle anwenden
    Ergebnis
    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Gehäuse gekühlt Befestigungsmethode Form Länge Breite Durchmesser Lamellenhöhe Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche
    260-6SH5E

    260-6SH5E

    HEAT SINK FOR TO-5 PKG

    Wakefield-Vette

    2,003
    RFQ
    260-6SH5E

    Datenblatt

    260 Bulk Active Board Level TO-5 Bolt On Cylindrical 0.557" (14.15mm) 0.370" (9.40mm) 0.290" (7.37mm) ID - - - 14.00°C/W - Black Ebonol
    ATS-X50325G-C1-R0

    ATS-X50325G-C1-R0

    SUPERGRIP HEATSINK 32X32X12.5MM

    Advanced Thermal Solutions Inc.

    125
    RFQ
    ATS-X50325G-C1-R0

    Datenblatt

    maxiFLOW, superGRIP™ Bulk Active Top Mount BGA Clip, Thermal Material Square, Angled Fins 1.260" (32.00mm) 1.260" (32.00mm) - 0.492" (12.50mm) - 3.50°C/W @ 200 LFM - Aluminum Blue Anodized
    258

    258

    .5X.25X.34 HEATSINK FOR DIODE

    Wakefield-Vette

    2,803
    RFQ
    258

    Datenblatt

    258 Bulk Active Board Level Stud Mounted Diode Type 120 Compound Rectangular 0.250" (6.35mm) 0.500" (12.70mm) - 0.340" (8.64mm) - - 12.00°C/W Aluminum -
    ATS-X53300P-C1-R0

    ATS-X53300P-C1-R0

    SUPERGRIP HEATSINK 30X30X17.5MM

    Advanced Thermal Solutions Inc.

    124
    RFQ
    ATS-X53300P-C1-R0

    Datenblatt

    superGRIP™ Bulk Active Top Mount BGA Clip, Thermal Material Square, Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.689" (17.50mm) - 4.80°C/W @ 200 LFM - Aluminum Blue Anodized
    ATS-NVA-3353-C1-R0

    ATS-NVA-3353-C1-R0

    ACTIVE HEATSINK 63X40X8MM NVIDIA

    Advanced Thermal Solutions Inc.

    2,506
    RFQ
    ATS-NVA-3353-C1-R0

    Datenblatt

    - Box Active Top Mount Nvidia Jetson TX2 NX Module Bolt On, Thermal Material Rectangular, Fins 2.480" (63.00mm) 1.575" (40.00mm) - 0.315" (8.00mm) - - 1.60°C/W Aluminum Black Anodized
    ATS-X53330P-C1-R0

    ATS-X53330P-C1-R0

    SUPERGRIP HEATSINK 33X33X17.5MM

    Advanced Thermal Solutions Inc.

    125
    RFQ
    ATS-X53330P-C1-R0

    Datenblatt

    superGRIP™ Bulk Active Top Mount BGA Clip, Thermal Material Square, Fins 1.299" (32.99mm) 1.299" (32.99mm) - 0.689" (17.50mm) - 4.10°C/W @ 200 LFM - Aluminum Blue Anodized
    ATS-NVA-2780-C1-R0

    ATS-NVA-2780-C1-R0

    ACTIVE HEATSINK 60X40X8MM NVIDIA

    Advanced Thermal Solutions Inc.

    2,044
    RFQ
    ATS-NVA-2780-C1-R0

    Datenblatt

    - Box Active Top Mount Nvidia Jetson Nano Bolt On, Thermal Material Rectangular, Fins 2.362" (60.00mm) 1.575" (40.00mm) - 0.315" (8.00mm) - - 1.60°C/W Aluminum Black Anodized
    ATS-56013-C3-R0

    ATS-56013-C3-R0

    HEAT SINK 42MM X 42MM X 16MM

    Advanced Thermal Solutions Inc.

    3,505
    RFQ
    ATS-56013-C3-R0

    Datenblatt

    maxiFLOW Bulk Active Top Mount ASIC Thermal Tape, Adhesive (Included) Square, Angled Fins 1.654" (42.00mm) 1.654" (42.00mm) - 0.630" (16.00mm) - 2.20°C/W @ 200 LFM - Aluminum Gold Anodized
    ATS-X50300P-C1-R0

    ATS-X50300P-C1-R0

    SUPERGRIP HEATSINK 30X30X17.5MM

    Advanced Thermal Solutions Inc.

    125
    RFQ
    ATS-X50300P-C1-R0

    Datenblatt

    maxiFLOW, superGRIP™ Bulk Active Top Mount BGA Clip, Thermal Material Square, Angled Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.689" (17.50mm) - 3.40°C/W @ 200 LFM - Aluminum Blue Anodized
    ATS-X50325P-C1-R0

    ATS-X50325P-C1-R0

    SUPERGRIP HEATSINK 32X32X17.5MM

    Advanced Thermal Solutions Inc.

    125
    RFQ
    ATS-X50325P-C1-R0

    Datenblatt

    maxiFLOW, superGRIP™ Bulk Active Top Mount BGA Clip, Thermal Material Square, Angled Fins 1.260" (32.00mm) 1.260" (32.00mm) - 0.689" (17.50mm) - 2.70°C/W @ 200 LFM - Aluminum Blue Anodized
    ATS-X50330P-C1-R0

    ATS-X50330P-C1-R0

    SUPERGRIP HEATSINK 33X33X17.5MM

    Advanced Thermal Solutions Inc.

    120
    RFQ
    ATS-X50330P-C1-R0

    Datenblatt

    maxiFLOW, superGRIP™ Bulk Active Top Mount BGA Clip, Thermal Material Square, Angled Fins 1.299" (32.99mm) 1.299" (32.99mm) - 0.689" (17.50mm) - 2.70°C/W @ 200 LFM - Aluminum Blue Anodized
    SM321-22001Y

    SM321-22001Y

    AMD 1U 92.4X118.X25MM

    Sunon Fans

    3,919
    RFQ
    SM321-22001Y

    Datenblatt

    - Box Active Top Mount AMD GENOA 9004 1U CPU Cooler Push Pin Rectangular, Fins 4.646" (118.00mm) 3.638" (92.40mm) - 0.984" (25.00mm) - - - Aluminum, Copper Nickel
    303N

    303N

    HEATSINK COMPACT

    Wakefield-Vette

    3,790
    RFQ
    303N

    Datenblatt

    303 Bulk Active Board Level, Vertical Stud Mounted Semiconductor Cases Press Fit Rectangular, Fins 2.000" (50.80mm) 3.000" (76.20mm) - 2.000" (50.80mm) 15.0W @ 37°C 1.30°C/W @ 250 LFM - Aluminum Alloy Black Anodized
    441K

    441K

    HEATSINK HIGH PWR RECT/DIODES

    Wakefield-Vette

    4,511
    RFQ
    441K

    Datenblatt

    441 Bulk Active Board Level, Extrusion Stud Mounted Diode Press Fit Rectangular, Fins 5.500" (139.70mm) 4.500" (114.30mm) - 4.500" (114.30mm) 50.0W @ 34°C 0.30°C/W @ 250 LFM - Aluminum Black Anodized
    HSF-55-24-Y-F

    HSF-55-24-Y-F

    FANSINK 12VDC 55X55X24.1MM

    Wakefield-Vette

    2,674
    RFQ
    HSF-55-24-Y-F

    Datenblatt

    HSF Bulk Active Top Mount BGA Clip Square, Fins 2.165" (55.00mm) 2.165" (55.00mm) - 0.949" (24.10mm) - - 1.00°C/W Aluminum Alloy Black Anodized
    HSF-48-25-Y-F

    HSF-48-25-Y-F

    FANSINK 5VDC 47.5X47.5X24.5MM

    Wakefield-Vette

    3,779
    RFQ
    HSF-48-25-Y-F

    Datenblatt

    HSF Bulk Active Top Mount BGA Clip Square, Fins 1.870" (47.50mm) 1.870" (47.50mm) - 0.965" (24.50mm) - - 0.98°C/W Aluminum Alloy Black Anodized
    HSF-55-24-B-F

    HSF-55-24-B-F

    FANSINK 12VDC 55X55X24.1MM

    Wakefield-Vette

    4,428
    RFQ
    HSF-55-24-B-F

    Datenblatt

    HSF Bulk Active Top Mount BGA Clip Square, Fins 2.165" (55.00mm) 2.165" (55.00mm) - 1.555" (39.50mm) - - 1.00°C/W Aluminum Alloy Black Anodized
    HSF-48-40-Y-F

    HSF-48-40-Y-F

    FANSINK 5VDC 47.5X47.5X39.5MM

    Wakefield-Vette

    1,938
    RFQ
    HSF-48-40-Y-F

    Datenblatt

    HSF Bulk Active Top Mount BGA Clip Square, Fins 1.870" (47.50mm) 1.870" (47.50mm) - 1.555" (39.50mm) - - 0.72°C/W Aluminum Alloy Black Anodized
    HSF-48-40-B-F

    HSF-48-40-B-F

    FANSINK 5VDC 47.5X47.5X39.5MM

    Wakefield-Vette

    4,749
    RFQ
    HSF-48-40-B-F

    Datenblatt

    HSF Bulk Active Top Mount BGA Clip Square, Fins 1.870" (47.50mm) 1.870" (47.50mm) - 1.358" (34.50mm) - - 0.72°C/W Aluminum Alloy Black Anodized
    ATS-LQHS-74030-C1-R0

    ATS-LQHS-74030-C1-R0

    LIQUID ASSISTED FANSINK ASMBLY,

    Advanced Thermal Solutions Inc.

    2,104
    RFQ
    ATS-LQHS-74030-C1-R0

    Datenblatt

    fanSINK™ Box Active Top Mount BGA Push Pin, Thermal Material Square, Pin Fins 2.913" (74.00mm) 2.913" (74.00mm) - 1.213" (30.80mm) - - 0.13°C/W - Black Anodized
    Total 122183 Record«Prev1... 537538539540541542543544...6110Next»
    Kontaktieren Sie uns Mehr Produktinformationen erhalten!
    BomKey Elektronik

    Startseite

    BomKey Elektronik

    Produkte

    BomKey Elektronik

    Telefon

    BomKey Elektronik

    Benutzer

    Günstige Preise jeden Tag, sorgenfreie Auswahl.
    Günstige Preise jeden Tag, sorgenfreie Auswahl.
    Echte lizenzierte Waren, exzellenter Service.
    Echte lizenzierte Waren, exzellenter Service.
    Direktlieferung aus mehreren Lagern, schnelle Lieferung.
    Direktlieferung aus mehreren Lagern, schnelle Lieferung.
    Vollständige Produktpalette für einfaches Einkaufen.
    Vollständige Produktpalette für einfaches Einkaufen.
    Copyright © 2025 Bomkey Elektronik. Alle Rechte vorbehalten