Bomkey (HK) Elektronik GmbH!

    Kühlkörper

    Hersteller Serie Verpackung Produktstatus Typ Gehäuse gekühlt Befestigungsmethode Form Länge Breite Durchmesser Lamellenhöhe Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche

    Alle zurücksetzen
    Alle anwenden
    Ergebnis
    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Gehäuse gekühlt Befestigungsmethode Form Länge Breite Durchmesser Lamellenhöhe Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche
    HSB24-252510

    HSB24-252510

    HEAT SINK, BGA,25 X 25 X 10 MM

    Same Sky (Formerly CUI Devices)

    322
    RFQ
    HSB24-252510

    Datenblatt

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.394" (10.00mm) 4.14W @ 75°C 6.50°C/W @ 200 LFM 18.10°C/W Aluminum Alloy Black Anodized
    6237BG

    6237BG

    BOARD LEVEL HEATSINK .375"TO-220

    Boyd Laconia, LLC

    631
    RFQ
    6237BG

    Datenblatt

    - Bulk Active Board Level TO-220 Clip Rectangular, Fins 0.700" (17.78mm) 0.900" (22.86mm) - 0.375" (9.52mm) 2.0W @ 50°C 14.00°C/W @ 200 LFM 25.00°C/W Aluminum Black Anodized
    HSE04-251265-2

    HSE04-251265-2

    HEAT SINK, EXTRUSION, TO-218/TO-

    Same Sky (Formerly CUI Devices)

    144
    RFQ
    HSE04-251265-2

    Datenblatt

    HSE Bag Active Top Mount TO-218, TO-220 Bolt On Rectangular, Fins 0.984" (25.00mm) 0.472" (12.00mm) - 0.256" (6.50mm) 2.47W @ 75°C 16.60°C/W @ 200 LFM 30.38°C/W Aluminum Alloy Black Anodized
    3084

    3084

    MINI ALUMINUM HEAT SINK FOR RASP

    Adafruit Industries LLC

    672
    RFQ
    3084

    Datenblatt

    - Bulk Active Top Mount Raspberry Pi, Raspberry Pi 3 Thermal Tape, Adhesive (Included) Square, Fins 0.512" (13.00mm) 0.512" (13.00mm) - 0.118" (3.00mm) - - - Aluminum -
    HSE-B20254-035H

    HSE-B20254-035H

    HEAT SINK, EXTRUSION, TO-220,25.

    Same Sky (Formerly CUI Devices)

    469
    RFQ
    HSE-B20254-035H

    Datenblatt

    HSE Box Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Angled Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) 5.8W @ 75°C 3.28°C/W @ 200 LFM 12.93°C/W Aluminum Alloy Black Anodized
    FIT0367

    FIT0367

    RASPBERRY PI COPPER HEATSINK

    DFRobot

    693
    RFQ
    FIT0367

    Datenblatt

    - Bulk Active Top Mount Raspberry Pi Thermal Tape, Adhesive (Included) Rectangular 0.520" (13.20mm) 0.476" (12.10mm) - - - - - Copper -
    114990125

    114990125

    HEAT SINK KIT FOR RASPBERRY PI

    Seeed Technology Co., Ltd

    418
    RFQ
    114990125

    Datenblatt

    - Bulk Active Top Mount Kit Raspberry Pi B+ Adhesive Square, Fins 2.598" (66.00mm) 2.598" (66.00mm) - 2.598" (66.00mm) - - - Aluminum -
    TGH-0190-01

    TGH-0190-01

    ALUMINIUM HEAT SINK 19X19MM

    t-Global Technology

    4,825
    RFQ
    TGH-0190-01

    Datenblatt

    TGH Bulk Active Top Mount - - Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.197" (5.00mm) - - - Aluminum Black Anodized
    ATS015015003-SF-4B

    ATS015015003-SF-4B

    HEATSINK 15X15X3MM

    Advanced Thermal Solutions Inc.

    100
    RFQ
    ATS015015003-SF-4B

    Datenblatt

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Fins 0.591" (15.00mm) 0.590" (15.00mm) - 0.118" (3.00mm) - 63.31°C/W @ 200 LFM - Aluminum Black Anodized
    V8818Q

    V8818Q

    HEATSINK ALUM ANOD

    Assmann WSW Components

    2,453
    RFQ
    V8818Q

    Datenblatt

    - Tray Active Board Level SOT-32, TO-220 Bolt On and PC Pin Rectangular, Fins 1.575" (40.00mm) 0.748" (19.00mm) - 0.844" (21.44mm) - - 8.80°C/W Aluminum Black Anodized
    ATS010010007-SF-1F

    ATS010010007-SF-1F

    HEATSINK 10X10X7MM

    Advanced Thermal Solutions Inc.

    2,186
    RFQ
    ATS010010007-SF-1F

    Datenblatt

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Fins 0.394" (10.00mm) 0.394" (10.00mm) - 0.276" (7.00mm) - 44.41°C/W @ 200 LFM - Aluminum Black Anodized
    ATS012012006-MF-2E

    ATS012012006-MF-2E

    MAXIFLOW HEATSINK 12X12X6MM

    Advanced Thermal Solutions Inc.

    1,867
    RFQ
    ATS012012006-MF-2E

    Datenblatt

    maxiFLOW Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Angled Fins 0.472" (12.00mm) 0.472" (12.00mm) - 0.236" (6.00mm) - 39.81°C/W @ 200 LFM - Aluminum Black Anodized
    M46165B021000G

    M46165B021000G

    MAX CLIP HEATSINK

    Boyd Laconia, LLC

    3,898
    RFQ
    M46165B021000G

    Datenblatt

    Max Clip System™ Bulk Active Board Level, Vertical TO-126, TO-220, TO-247 Clip and PC Pin Rectangular, Fins 1.620" (41.15mm) 1.181" (30.00mm) - 1.909" (48.50mm) - - - Aluminum Black Anodized
    ATS044044004-PF028

    ATS044044004-PF028

    PINFIN HEATSINK 43.5X43.5X3.8MM

    Advanced Thermal Solutions Inc.

    1,274
    RFQ
    ATS044044004-PF028

    Datenblatt

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.713" (43.50mm) 1.713" (43.50mm) - 0.150" (3.81mm) - 8.00°C/W @ 200 LFM - Aluminum Black Anodized
    537-95AB

    537-95AB

    HEATSINK DC DC 1/4 BRICK VERT

    Wakefield-Vette

    3,448
    RFQ
    537-95AB

    Datenblatt

    537 Bulk Active Top Mount Quarter Brick DC/DC Converter Bolt On, Thermal Material Rectangular, Fins 2.280" (57.90mm) 1.450" (36.83mm) - 0.950" (24.13mm) - 2.10°C/W @ 300 LFM - Aluminum Black Anodized
    FIT0506

    FIT0506

    PURE COPPER HEATSINK PACK OF 5 (

    DFRobot

    1,635
    RFQ
    FIT0506

    Datenblatt

    LattePanda Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Rectangular 0.520" (13.20mm) 0.480" (12.19mm) - 0.189" (4.80mm) - - - Copper -
    FIT0980

    FIT0980

    RASPBERRY PI 5 ALUMINUM FAN

    DFRobot

    1,282
    RFQ
    FIT0980

    Datenblatt

    - Bulk Active Top Mount with Fan Raspberry Pi 5 Push Pin Rectangular, Pin Fins 2.559" (65.00mm) 1.772" (45.00mm) - 0.709" (18.00mm) - - - Aluminum Alloy -
    FIT0816

    FIT0816

    RASPBERRYPISINGLECOOLINGFANKIT (

    DFRobot

    4,654
    RFQ
    FIT0816

    Datenblatt

    - Bulk Active Top Mount Raspberry Pi 3B, 3B+, 4B Thermal Tape, Adhesive (Included) Square, Pin Fins - - - - - - - Aluminum Black Anodized
    ATS-FPS058037011-32-C2-R0

    ATS-FPS058037011-32-C2-R0

    HEATSINK 57.9X36.83X11.43MM FP

    Advanced Thermal Solutions Inc.

    100
    RFQ
    ATS-FPS058037011-32-C2-R0

    Datenblatt

    pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Rectangular, Fins 2.280" (57.90mm) 1.450" (36.83mm) - 0.450" (11.43mm) - 21.46°C/W @ 100 LFM - Aluminum Blue Anodized
    ATS-CPX060060010-129-C2-R0

    ATS-CPX060060010-129-C2-R0

    HEATSINK 60X60X10MM XCUT CP

    Advanced Thermal Solutions Inc.

    2,351
    RFQ
    ATS-CPX060060010-129-C2-R0

    Datenblatt

    pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 2.362" (60.00mm) 2.362" (60.00mm) - 0.394" (10.00mm) - 8.65°C/W @ 100 LFM - Aluminum Blue Anodized
    Total 122183 Record«Prev1... 478479480481482483484485...6110Next»
    Kontaktieren Sie uns Mehr Produktinformationen erhalten!
    BomKey Elektronik

    Startseite

    BomKey Elektronik

    Produkte

    BomKey Elektronik

    Telefon

    BomKey Elektronik

    Benutzer

    Günstige Preise jeden Tag, sorgenfreie Auswahl.
    Günstige Preise jeden Tag, sorgenfreie Auswahl.
    Echte lizenzierte Waren, exzellenter Service.
    Echte lizenzierte Waren, exzellenter Service.
    Direktlieferung aus mehreren Lagern, schnelle Lieferung.
    Direktlieferung aus mehreren Lagern, schnelle Lieferung.
    Vollständige Produktpalette für einfaches Einkaufen.
    Vollständige Produktpalette für einfaches Einkaufen.
    Copyright © 2025 Bomkey Elektronik. Alle Rechte vorbehalten