Bomkey (HK) Elektronik GmbH!

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    Hersteller Serie Verpackung Produktstatus Typ Gehäuse gekühlt Befestigungsmethode Form Länge Breite Durchmesser Lamellenhöhe Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Gehäuse gekühlt Befestigungsmethode Form Länge Breite Durchmesser Lamellenhöhe Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche
    530613B00000G

    530613B00000G

    HEATSINK TO-220 BLACK 1.18"

    Boyd Laconia, LLC

    206
    RFQ
    530613B00000G

    Datenblatt

    - Bag Active Board Level TO-220 Bolt On Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 4.0W @ 80°C 6.00°C/W @ 600 LFM 16.70°C/W Aluminum Black Anodized
    UPTO3CB

    UPTO3CB

    HEATSINK PWR MED-HI BLACK TO-3

    CTS Thermal Management Products

    685
    RFQ
    UPTO3CB

    Datenblatt

    - Box Active Board Level TO-3 Bolt On Square, Pin Fins 1.780" (45.21mm) 1.780" (45.21mm) - 1.000" (25.40mm) - - 9.00°C/W Aluminum Black Anodized
    APF19-19-10CB

    APF19-19-10CB

    HEATSINK LOW-PROFILE FORGED

    CTS Thermal Management Products

    23,859
    RFQ
    APF19-19-10CB

    Datenblatt

    APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.370" (9.40mm) - 5.30°C/W @ 200 LFM - Aluminum Black Anodized
    ATS012012010-SF-2I

    ATS012012010-SF-2I

    HEATSINK 12X12X10MM

    Advanced Thermal Solutions Inc.

    114
    RFQ
    ATS012012010-SF-2I

    Datenblatt

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Fins 0.472" (12.00mm) 0.472" (12.00mm) - 0.394" (10.00mm) - 23.70°C/W @ 200 LFM - Aluminum Black Anodized
    326005B00000G

    326005B00000G

    HEATSINK TO-5 1W H=.375" BLK

    Boyd Laconia, LLC

    1,363
    RFQ
    326005B00000G

    Datenblatt

    - Bag Active Board Level TO-5 Press Fit Cylindrical - - 0.318" (8.07mm) ID, 0.500" (12.70mm) OD 0.375" (9.52mm) 1.8W @ 90°C 30.00°C/W @ 200 LFM 57.00°C/W Aluminum Black Anodized
    574502B03700G

    574502B03700G

    HEATSINK TO220 VER MNT W/TAB.75"

    Boyd Laconia, LLC

    1,895
    RFQ
    574502B03700G

    Datenblatt

    - Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.810" (20.57mm) - 0.390" (9.91mm) 3.0W @ 60°C 8.00°C/W @ 400 LFM 21.20°C/W Aluminum Black Anodized
    ATS-CPX040040025-116-C2-R0

    ATS-CPX040040025-116-C2-R0

    HEATSINK 40X40X25MM XCUT CP

    Advanced Thermal Solutions Inc.

    1,143
    RFQ
    ATS-CPX040040025-116-C2-R0

    Datenblatt

    pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.984" (25.00mm) - 4.14°C/W @ 100 LFM - Aluminum Blue Anodized
    ATS-FPS058037011-32-C1-R0

    ATS-FPS058037011-32-C1-R0

    HEATSINK 57.9X36.83X11.43MM FP

    Advanced Thermal Solutions Inc.

    276
    RFQ
    ATS-FPS058037011-32-C1-R0

    Datenblatt

    pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Rectangular, Fins 2.280" (57.90mm) 1.450" (36.83mm) - 0.450" (11.43mm) - 21.45°C/W @ 100 LFM - Aluminum Blue Anodized
    TGH-0400-03

    TGH-0400-03

    ALUMINIUM HEAT SINK 40X40MM

    t-Global Technology

    809
    RFQ
    TGH-0400-03

    Datenblatt

    TGH Bulk Active Top Mount - - Square, Pin Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.433" (11.00mm) - - - Aluminum Black Anodized
    505403B00000G

    505403B00000G

    HEATSINK TO-3 H31.75MM

    Boyd Laconia, LLC

    3,143
    RFQ
    505403B00000G

    Datenblatt

    - Bulk Active Board Level TO-3 Bolt On Square, Pin Fins 1.780" (45.21mm) 1.780" (45.21mm) - 1.250" (31.75mm) 7.0W @ 40°C 1.50°C/W @ 600 LFM 6.00°C/W Aluminum Black Anodized
    ATS-CPX025025010-137-C2-R0

    ATS-CPX025025010-137-C2-R0

    HEATSINK 25X25X10MM L-TAB CP

    Advanced Thermal Solutions Inc.

    849
    RFQ
    ATS-CPX025025010-137-C2-R0

    Datenblatt

    pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.394" (10.00mm) - 18.36°C/W @ 100 LFM - Aluminum Blue Anodized
    523002B00000G

    523002B00000G

    HEATSINK TO-220 W/TAB BLACK

    Boyd Laconia, LLC

    3,465
    RFQ
    523002B00000G

    Datenblatt

    - Bag Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 1.0W @ 20°C 6.00°C/W @ 300 LFM 13.60°C/W Aluminum Black Anodized
    ATS-CPX050050025-124-C2-R0

    ATS-CPX050050025-124-C2-R0

    HEATSINK 50X50X25MM XCUT CP

    Advanced Thermal Solutions Inc.

    2,455
    RFQ
    ATS-CPX050050025-124-C2-R0

    Datenblatt

    pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 1.969" (50.00mm) 1.969" (50.00mm) - 0.984" (25.00mm) - 3.18°C/W @ 100 LFM - Aluminum Blue Anodized
    7-345-2PP-BA

    7-345-2PP-BA

    HEATSINK PWR DUAL BLACK TO-220

    CTS Thermal Management Products

    1,067
    RFQ
    7-345-2PP-BA

    Datenblatt

    7 Box Active Board Level TO-220 Bolt On Rectangular, Fins 1.500" (38.10mm) 2.000" (50.80mm) - 0.553" (14.05mm) 6.0W @ 25°C - 4.70°C/W Aluminum Black Anodized
    BDN11-3CB/A01

    BDN11-3CB/A01

    HEATSINK CPU W/ADHESIVE 1.11"SQ

    CTS Thermal Management Products

    878
    RFQ
    BDN11-3CB/A01

    Datenblatt

    BDN Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.110" (28.19mm) 1.110" (28.19mm) - 0.355" (9.02mm) - 7.20°C/W @ 400 LFM 20.90°C/W Aluminum Black Anodized
    ATS-CPX040040025-116-C1-R0

    ATS-CPX040040025-116-C1-R0

    HEATSINK 40X40X25MM XCUT CP

    Advanced Thermal Solutions Inc.

    510
    RFQ
    ATS-CPX040040025-116-C1-R0

    Datenblatt

    pushPIN™ Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.984" (25.00mm) - 4.11°C/W @ 100 LFM - Aluminum Blue Anodized
    567-24AB

    567-24AB

    1/8 BRICK HEATSINK 55X20.7X6.1MM

    Wakefield-Vette

    129
    RFQ
    567-24AB

    Datenblatt

    567 Tray Active Top Mount Eighth Brick DC/DC Converter Bolt On, Thermal Material Rectangular, Fins 2.165" (55.00mm) 0.815" (20.70mm) - 0.240" (6.10mm) - 7.20°C/W @ 300 LFM 7.20°C/W - Unfinished
    567-45AB

    567-45AB

    1/8 BRICK HEATSINK 55X20.7X11.4M

    Wakefield-Vette

    599
    RFQ
    567-45AB

    Datenblatt

    567 Bulk Active Top Mount Eighth Brick DC/DC Converter Bolt On, Thermal Material Rectangular, Fins 2.165" (55.00mm) 0.815" (20.70mm) - 0.449" (11.40mm) - 4.30°C/W @ 300 LFM 4.30°C/W - Unfinished
    374424B00035G

    374424B00035G

    HEATSINK BGA W/ADHESIVE TAPE

    Boyd Laconia, LLC

    1,162
    RFQ
    374424B00035G

    Datenblatt

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.709" (18.00mm) 4.0W @ 80°C 6.50°C/W @ 200 LFM 20.30°C/W Aluminum Black Anodized
    ATS-CPX025025020-139-C2-R0

    ATS-CPX025025020-139-C2-R0

    HEATSINK 25X25X20MM L-TAB CP

    Advanced Thermal Solutions Inc.

    1,981
    RFQ
    ATS-CPX025025020-139-C2-R0

    Datenblatt

    pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.790" (20.00mm) - 9.10°C/W @ 100 LFM - Aluminum Blue Anodized
    Total 122183 Record«Prev1... 1617181920212223...6110Next»
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