Bomkey (HK) Elektronik GmbH!

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    Hersteller Serie Verpackung Produktstatus Typ Gehäuse gekühlt Befestigungsmethode Form Länge Breite Durchmesser Lamellenhöhe Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Gehäuse gekühlt Befestigungsmethode Form Länge Breite Durchmesser Lamellenhöhe Leistungsabgabe bei Temperaturanstieg Wärmewiderstand bei forciertem Luftstrom Wärmewiderstand bei natürlichem Zustand Material Materialoberfläche
    658-35AB

    658-35AB

    HEATSINK CPU 28MM SQBLK W/O TAPE

    Wakefield-Vette

    13,852
    RFQ
    658-35AB

    Datenblatt

    658 Tray Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.350" (8.89mm) - 3.00°C/W @ 800 LFM - Aluminum Black Anodized
    V2268E1

    V2268E1

    CPU HEATSINK, CROSS CUT, AL6063,

    Assmann WSW Components

    1,929
    RFQ
    V2268E1

    Datenblatt

    - Bulk Active Top Mount - Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.669" (17.00mm) 0.669" (17.00mm) - 0.236" (6.00mm) - - 30.00°C/W Aluminum Alloy Black Anodized
    HSE-B20254-040H

    HSE-B20254-040H

    HEAT SINK, EXTRUSION, TO-220, 25

    Same Sky (Formerly CUI Devices)

    2,107
    RFQ
    HSE-B20254-040H

    Datenblatt

    HSE Bag Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.260" (32.00mm) - 0.551" (14.00mm) 5.7W @ 75°C 7.74°C/W @ 200 LFM 13.16°C/W Aluminum Alloy Black Anodized
    HSE-B20250-045H

    HSE-B20250-045H

    HEAT SINK, EXTRUSION, TO-220, 50

    Same Sky (Formerly CUI Devices)

    868
    RFQ
    HSE-B20250-045H

    Datenblatt

    HSE Box Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.969" (50.00mm) 1.181" (30.00mm) - 0.472" (12.00mm) 7.7W @ 75°C 4.05°C/W @ 200 LFM 9.74°C/W Aluminum Alloy Black Anodized
    V2269E1

    V2269E1

    CPU HEATSINK, CROSS CUT, AL6063,

    Assmann WSW Components

    1,083
    RFQ
    V2269E1

    Datenblatt

    - Bulk Active Top Mount - Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.787" (20.00mm) 0.787" (20.00mm) - 0.354" (9.00mm) - - 27.00°C/W Aluminum Alloy Black Anodized
    576802B03900G

    576802B03900G

    HEATSINK TO220 CLIPON W/TAB.75"

    Boyd Laconia, LLC

    15,144
    RFQ
    576802B03900G

    Datenblatt

    - Bulk Active Board Level, Vertical TO-220, TO-262 Clip and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.500" (12.70mm) - 0.500" (12.70mm) 1.0W @ 30°C 7.00°C/W @ 400 LFM 27.30°C/W Aluminum Black Anodized
    7142DG

    7142DG

    HEATSINK TO-220 TIN CLIP-ON 21MM

    Boyd Laconia, LLC

    4,435
    RFQ
    7142DG

    Datenblatt

    - Bulk Active Board Level TO-220 Clip and Board Locks Rectangular, Fins 0.780" (19.81mm) 0.520" (13.21mm) - 0.515" (13.08mm) 1.0W @ 30°C 8.00°C/W @ 400 LFM 20.30°C/W Copper Tin
    HSB26-343408

    HSB26-343408

    HEAT SINK, BGA, 33.5 X 33.5 X 8

    Same Sky (Formerly CUI Devices)

    524
    RFQ
    HSB26-343408

    Datenblatt

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 1.319" (33.50mm) 1.319" (33.50mm) - 0.315" (8.00mm) 4.94W @ 75°C 5.30°C/W @ 200 LFM 15.19°C/W Aluminum Alloy Black Anodized
    7173DG

    7173DG

    BOARD LEVEL HEATSINK .375"TO-220

    Boyd Laconia, LLC

    5,532
    RFQ
    7173DG

    Datenblatt

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.750" (19.05mm) - 0.375" (9.52mm) 1.5W @ 50°C 10.00°C/W @ 200 LFM 25.80°C/W Copper Tin
    658-45AB

    658-45AB

    HEATSINK CPU 28MM SQBLK W/O TAPE

    Wakefield-Vette

    2,642
    RFQ
    658-45AB

    Datenblatt

    658 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.450" (11.43mm) 3.0W @ 50°C 6.00°C/W @ 200 LFM - Aluminum Black Anodized
    HSE-B250-04H

    HSE-B250-04H

    HEAT SINK, EXTRUSION, TO-220, 25

    Same Sky (Formerly CUI Devices)

    2,215
    RFQ
    HSE-B250-04H

    Datenblatt

    HSE Box Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.984" (25.00mm) 1.378" (35.00mm) - 1.000" (25.40mm) 8.0W @ 75°C 3.26°C/W @ 200 LFM 13.60°C/W Aluminum Alloy Black Anodized
    HSE-B20500-040H

    HSE-B20500-040H

    HEAT SINK, EXTRUSION, TO-220, 50

    Same Sky (Formerly CUI Devices)

    727
    RFQ
    HSE-B20500-040H

    Datenblatt

    HSE Tray Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Angled Fins 1.969" (50.00mm) 1.378" (35.00mm) - 0.492" (12.50mm) 8.9W @ 75°C 4.85°C/W @ 200 LFM 8.43°C/W Aluminum Alloy Black Anodized
    574902B03300G

    574902B03300G

    HEATSINK TO-220 VERT MNT W/TAB

    Boyd Laconia, LLC

    5,561
    RFQ
    574902B03300G

    Datenblatt

    - Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular 1.375" (34.93mm) 0.860" (21.84mm) - 0.395" (10.03mm) 2.5W @ 40°C 6.00°C/W @ 400 LFM 16.00°C/W Aluminum Black Anodized
    651-B

    651-B

    HEATSINK 14-16PIN DIP BLK

    Wakefield-Vette

    1,025
    RFQ
    651-B

    Datenblatt

    651 Bulk Active Top Mount 14-DIP and 16-DIP Thermal Tape, Adhesive (Not Included) Rectangular, Fins 0.750" (19.05mm) 0.415" (10.54mm) - 0.240" (6.10mm) 0.5W @ 40°C 40.00°C/W @ 300 LFM - Aluminum Black Anodized
    V5619B

    V5619B

    HEATSINK ALUM ANOD

    Assmann WSW Components

    3,025
    RFQ
    V5619B

    Datenblatt

    - Bulk Active Top Mount 24-DIP Press Fit Rectangular, Fins 1.299" (32.99mm) 0.748" (19.00mm) - 0.189" (4.80mm) - - 48.00°C/W Aluminum Black Anodized
    ATS-PCB1029

    ATS-PCB1029

    HEATSINK TO-220 BLACK

    Advanced Thermal Solutions Inc.

    6,605
    RFQ
    ATS-PCB1029

    Datenblatt

    - Bulk Active Board Level TO-220 Bolt On Rectangular, Fins 1.000" (25.40mm) 1.551" (39.40mm) - 0.374" (9.50mm) - 6.80°C/W @ 200 LFM 11.00°C/W Aluminum Black Anodized
    V8813Y

    V8813Y

    HEATSINK TO-220/TOP-3/SOT-32

    Assmann WSW Components

    399
    RFQ
    V8813Y

    Datenblatt

    - Tray Active Board Level, Vertical SOT-32, TO-220, TOP-3 Bolt On and PC Pin Rectangular, Fins 1.969" (50.00mm) 1.359" (34.50mm) - 0.492" (12.50mm) - - 8.80°C/W Aluminum Black Anodized
    HSB11-252518

    HSB11-252518

    HEAT SINK, BGA, 25 X 25 X 18 MM

    Same Sky (Formerly CUI Devices)

    2,722
    RFQ
    HSB11-252518

    Datenblatt

    HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.709" (18.00mm) 5.5W @ 75°C 4.50°C/W @ 200 LFM 13.70°C/W Aluminum Alloy Black Anodized
    XL25W-12-12-10

    XL25W-12-12-10

    CERAMIC HEAT SINK 12X12X10MM WHI

    t-Global Technology

    2,324
    RFQ
    XL25W-12-12-10

    Datenblatt

    XL-25 Bulk Active Heat Spreader Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape Square 0.472" (12.00mm) 0.472" (12.00mm) - 0.394" (10.00mm) - - - Ceramic -
    657-15ABPEN

    657-15ABPEN

    HEATSINK TO-220 W/PINS BLK 1.5"

    Wakefield-Vette

    2,871
    RFQ
    657-15ABPEN

    Datenblatt

    657 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.500" (38.10mm) 6.0W @ 38°C 3.30°C/W @ 200 LFM - Aluminum Black Anodized
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