852-69415941
IC-Sockel
| Foto | Hersteller-Teilenr. | Verfügbarkeit | Menge | Datenblatt | Serie | Verpackung | Produktstatus | Typ | Anzahl der Positionen oder Stifte (Gitter) | Abstand - Paarung | Kontaktoberfläche – Paarung | Kontaktoberflächendicke - Paarung | Kontaktmaterial - Paarung | Montageart | Funktionen | Anschluss | Abstand - Pfosten | Kontaktoberfläche - Pfosten | Kontaktoberflächendicke - Pfosten | Kontaktmaterial - Pfosten | Gehäusematerial | Betriebstemperatur |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
614-13-144-12-000012SKT CARRIER PGA |
3,212 |
|
Datenblatt |
614 | Bulk | Active | PGA | 144 (12 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
614-13-223-18-098012SKT CARRIER PGA |
2,490 |
|
Datenblatt |
614 | Bulk | Active | PGA | 223 (18 x 18) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
614-13-225-18-091007SKT CARRIER PGA |
1,816 |
|
Datenblatt |
614 | Bulk | Active | PGA | 225 (18 x 18) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
614-13-400-20-000001SKT CARRIER PGA |
4,609 |
|
Datenblatt |
614 | Bulk | Active | PGA | 400 (20 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
614-93-241-18-075012SKT CARRIER PGA |
4,600 |
|
Datenblatt |
614 | Bulk | Active | PGA | 241 (18 x 18) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
940-44-084-17-400004CONN SKT PLCC |
4,171 |
|
Datenblatt |
940 | Tape & Reel (TR) | Active | PLCC | 84 (4 x 21) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | - | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 200.0µin (5.08µm) | - | Polyphenylene Sulfide (PPS) | - |
|
|
D01-9933201CONNECTOR |
2,058 |
|
Datenblatt |
D01-993 | Bulk | Obsolete | SIP | 32 (1 x 32) | 0.100" (2.54mm) | Tin | - | Brass | Through Hole | - | Solder Cup | 0.100" (2.54mm) | Tin | - | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
|
8114LB603GHEATSINK |
4,776 |
|
Datenblatt |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
PX-20LCCLEADLESS CHIP CARRIER 20P PBT RO |
4,708 |
|
Datenblatt |
PX | Tube | Obsolete | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 75°C |
|
|
PX-28LCCLEADLESS CHIP CARRIER 28P PBT RO |
4,212 |
|
Datenblatt |
PX | Tube | Obsolete | PLCC | 28 (4 x 7) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 75°C |
|
|
PX-32LCCLEADLESS CHIP CARRIER 32P PBT RO |
1,937 |
|
Datenblatt |
PX | Tube | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 75°C |
|
|
PX-44LCCLEADLESS CHIP CARRIER 44P PBT RO |
4,047 |
|
Datenblatt |
PX | Tube | Obsolete | PLCC | 44 (4 x 11) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 75°C |
|
|
PX-52LCCLEADLESS CHIP CARRIER 52P PBT RO |
1,427 |
|
Datenblatt |
PX | Tube | Obsolete | PLCC | 52 (4 x 13) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 75°C |
|
|
PX-68LCCLEADLESS CHIP CARRIER 68P PBT RO |
1,994 |
|
Datenblatt |
PX | Tube | Obsolete | PLCC | 68 (4 x 17) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 75°C |
|
|
PX-84LCCLEADLESS CHIP CARRIER 84P PBT RO |
4,688 |
|
Datenblatt |
PX | Tube | Obsolete | PLCC | 84 (4 x 21) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 75°C |
|
|
2255-929A-90-2401CONN TEST & BURN-IN BGA SOCKET |
4,461 |
|
Datenblatt |
- | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
2320-9220-02-2401CONN TEST & BURN-IN BGA SOCKET |
3,241 |
|
Datenblatt |
- | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
2432-9235-01-2401CONN TEST & BURN-IN BGA SOCKET |
1,823 |
|
Datenblatt |
- | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
2256-6321-9UA-1902GRID ZIP 21 X 21 |
2,394 |
|
Datenblatt |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 256 (21 x 21) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
276-6321-9UA-1902TEST BURN-IN PGA |
1,498 |
|
Datenblatt |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 76 (21 x 21) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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