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    Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
    ICS-640-T

    ICS-640-T

    IC SOCKET, DIP, 40P 2.54MM PITCH

    Adam Tech

    5,036
    RFQ
    ICS-640-T

    Datenblatt

    ICS Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    ED16DT

    ED16DT

    CONN IC DIP SOCKET 16POS TIN

    On Shore Technology Inc.

    4,120
    RFQ
    ED16DT

    Datenblatt

    ED Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 110°C
    DILB24P-223TLF

    DILB24P-223TLF

    CONN IC DIP SOCKET 24POS TINLEAD

    Amphenol ICC (FCI)

    6,814
    RFQ
    DILB24P-223TLF

    Datenblatt

    DILB Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 125°C
    ED20DT

    ED20DT

    CONN IC DIP SOCKET 20POS TIN

    On Shore Technology Inc.

    15,136
    RFQ
    ED20DT

    Datenblatt

    ED Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 110°C
    243-20-1-03

    243-20-1-03

    CONN IC DIP SOCKET 20POS TIN

    CNC Tech

    7,380
    RFQ
    243-20-1-03

    Datenblatt

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    245-16-1-03

    245-16-1-03

    CONN IC DIP SOCKET 16POS TIN

    CNC Tech

    5,485
    RFQ
    245-16-1-03

    Datenblatt

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    DILB14P-223TLF

    DILB14P-223TLF

    CONN IC DIP SOCKET 14POS TIN

    Amphenol ICC (FCI)

    1,295
    RFQ
    DILB14P-223TLF

    Datenblatt

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 105°C
    D01-9970342

    D01-9970342

    CONN SOCKET SIP 3POS GOLD

    Harwin Inc.

    9,747
    RFQ
    D01-9970342

    Datenblatt

    D01-997 Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-306-41-001101

    110-87-306-41-001101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    6,785
    RFQ
    110-87-306-41-001101

    Datenblatt

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A 24-LC-TT

    A 24-LC-TT

    CONN IC DIP SOCKET 24POS TIN

    Assmann WSW Components

    1,965
    RFQ
    A 24-LC-TT

    Datenblatt

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    245-18-1-03

    245-18-1-03

    CONN IC DIP SOCKET 18POS TIN

    CNC Tech

    1,776
    RFQ
    245-18-1-03

    Datenblatt

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    DILB20P-223TLF

    DILB20P-223TLF

    CONN IC DIP SOCKET 20POS TIN

    Amphenol ICC (FCI)

    10,824
    RFQ
    DILB20P-223TLF

    Datenblatt

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 105°C
    DILB32P-223TLF

    DILB32P-223TLF

    CONN IC DIP SOCKET 32POS TINLEAD

    Amphenol ICC (FCI)

    6,231
    RFQ
    DILB32P-223TLF

    Datenblatt

    DILB Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 125°C
    SA083000

    SA083000

    CONN IC DIP SOCKET 8POS GOLD

    On Shore Technology Inc.

    4,096
    RFQ
    SA083000

    Datenblatt

    SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    AR 06-HZL/01-TT

    AR 06-HZL/01-TT

    CONN IC DIP SOCKET 6POS GOLD

    Assmann WSW Components

    20,223
    RFQ
    AR 06-HZL/01-TT

    Datenblatt

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    ICM-308-1-GT-HT

    ICM-308-1-GT-HT

    MACHINE PIN SOCKET, IC, DIP, 8P

    Adam Tech

    2,929
    RFQ
    ICM-308-1-GT-HT

    Datenblatt

    ICM Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
    A 28-LC-TT

    A 28-LC-TT

    CONN IC DIP SOCKET 28POS TIN

    Assmann WSW Components

    1,565
    RFQ
    A 28-LC-TT

    Datenblatt

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    A 20-LC-TT

    A 20-LC-TT

    CONN IC DIP SOCKET 20POS TIN

    Assmann WSW Components

    1,487
    RFQ
    A 20-LC-TT

    Datenblatt

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    245-20-1-03

    245-20-1-03

    CONN IC DIP SOCKET 20POS TIN

    CNC Tech

    1,216
    RFQ
    245-20-1-03

    Datenblatt

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    210-1-06-003

    210-1-06-003

    CONN IC DIP SOCKET 6POS GOLD

    CNC Tech

    7,529
    RFQ
    210-1-06-003

    Datenblatt

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
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