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    RFI und EMI - Kontakte, Fingerstock und Dichtungen

    Hersteller Serie Verpackung Produktstatus Typ Form Breite Länge Höhe Material Beschichtung Beschichtung - Dicke Befestigungsmethode Betriebstemperatur

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Form Breite Länge Höhe Material Beschichtung Beschichtung - Dicke Befestigungsmethode Betriebstemperatur
    0098054002

    0098054002

    RFI FINGERSTOCK BECU ADH

    Laird Technologies EMI

    2,649
    RFQ
    0098054002

    Datenblatt

    Ultrasoft All-Purpose Bulk Active Fingerstock - 0.280" (7.11mm) 16.000" (406.40mm) 0.110" (2.79mm) Beryllium Copper - - Adhesive 121°C
    0097054017

    0097054017

    RFI FINGERSTOCK BECU TIN ADH

    Laird Technologies EMI

    1,176
    RFQ
    0097054017

    Datenblatt

    All-Purpose Bulk Active Fingerstock - 0.280" (7.11mm) 15.984" (406.00mm) 0.110" (2.79mm) Beryllium Copper Tin 299.99µin (7.62µm) Adhesive 121°C
    4520AC51K09600

    4520AC51K09600

    RFI FOF GASKET PU

    Laird Technologies EMI

    4,935
    RFQ
    4520AC51K09600

    Datenblatt

    51K Bulk Active Fabric Over Foam Square 2.000" (50.80mm) 96.000" (2.44m) 2.000" (50.80mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - - -
    25-78FS-BD-85.875-NTP

    25-78FS-BD-85.875-NTP

    RFI FINGERSTOCK BECU UNPLAT ADH

    Leader Tech Inc.

    4,146
    RFQ
    25-78FS-BD-85.875-NTP

    Datenblatt

    - Bulk Active Fingerstock - 0.780" (19.81mm) 85.920" (2.18m) 0.250" (6.35mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
    0078007217

    0078007217

    RFI FINGERSTOCK BECU TIN SLOT

    Laird Technologies EMI

    4,924
    RFQ
    0078007217

    Datenblatt

    Ultrasoft Hook-on Bulk Active Fingerstock - 0.600" (15.24mm) 16.200" (411.48mm) 0.152" (3.86mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot 121°C
    4688PA51H09600

    4688PA51H09600

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    3,185
    RFQ
    4688PA51H09600

    Datenblatt

    51H Bulk Active Fabric Over Foam Rectangle 0.118" (3.00mm) 96.000" (2.44m) 0.079" (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -
    37-131-1007-09600

    37-131-1007-09600

    RFI FOF GASKET NI/CU NICKEL ADH

    Parker Chomerics

    4,152
    RFQ
    37-131-1007-09600

    Datenblatt

    SOFT-SHIELD® 3700 Box Active Fabric Over Foam Rectangle 1.614" (41.00mm) 8.00' (2.44m) 0.075" (1.91mm) Nickel-Copper Polyester (NI/CU) Nickel - Adhesive -40°C ~ 125°C
    0097054219

    0097054219

    RFI FINGERSTOCK BECU NICKEL ADH

    Laird Technologies EMI

    2,207
    RFQ
    0097054219

    Datenblatt

    Foldover Bulk Active Fingerstock - 0.250" (6.35mm) 15.984" (406.00mm) 0.080" (2.03mm) Beryllium Copper Nickel 299.99µin (7.62µm) Adhesive 121°C
    0097060719

    0097060719

    RFI FINGERSTOCK BECU NICKEL CLIP

    Laird Technologies EMI

    1,579
    RFQ
    0097060719

    Datenblatt

    - Bulk Active Fingerstock - - 16.000" (406.40mm) 0.170" (4.32mm) Beryllium Copper Nickel 299.21µin (7.60µm) Clip 121°C
    0098053817

    0098053817

    AP,STR,SNB,USF,PSA/.250X.780X.37

    Laird Technologies EMI

    4,273
    RFQ
    0098053817

    Datenblatt

    * Bulk Active - - - - - - - - - -
    0C97044017

    0C97044017

    RFI FINGERSTOCK BECU TIN HARDWR

    Laird Technologies EMI

    3,631
    RFQ
    0C97044017

    Datenblatt

    Large Enclosure Bulk Active Fingerstock - 1.630" (41.40mm) 25.00' (7.60m) 0.410" (10.41mm) Beryllium Copper Tin 299.99µin (7.62µm) Hardware, Rivet, Solder 121°C
    8516-0359-56

    8516-0359-56

    MILCONNECTOR,MIM613 35.12X30.15X

    Laird Technologies EMI

    4,337
    RFQ
    8516-0359-56

    Datenblatt

    MIL Connector Bulk Active - - - - - - - - - -
    8864-0110-93

    8864-0110-93

    RFI GASKET

    Laird Technologies EMI

    1,792
    RFQ
    8864-0110-93

    Datenblatt

    Electroseal™ Bulk Active Gasket Round 0.250" (6.35mm) - 0.250" (6.35mm) - - - - -
    4358PA51G09600

    4358PA51G09600

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    2,948
    RFQ
    4358PA51G09600

    Datenblatt

    51G Bulk Active Fabric Over Foam D-Shape 0.098" (2.49mm) 8.00' (2.44m) 0.630" (16.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 85°C
    0098051502

    0098051502

    RFI FINGERSTOCK BECU ADH

    Laird Technologies EMI

    4,364
    RFQ
    0098051502

    Datenblatt

    Ultrasoft Foldover Bulk Active Fingerstock - 0.760" (19.30mm) 24.000" (609.60mm) 0.230" (5.84mm) Beryllium Copper - 299.21µin (7.60µm) Adhesive 121°C
    4912PA51H08400

    4912PA51H08400

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    3,978
    RFQ
    4912PA51H08400

    Datenblatt

    ECOGREEN™ Bulk Active Fabric Over Foam D-Shape 0.150" (3.81mm) 7.00' (2.13m) 0.090" (2.29mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
    13-30RH-SN-0.356

    13-30RH-SN-0.356

    RFI FINGERSTOCK BECU TIN ADH

    Leader Tech Inc.

    1,798
    RFQ
    13-30RH-SN-0.356

    Datenblatt

    - Bulk Active Fingerstock - 0.300" (7.62mm) 0.356" (9.04mm) 0.130" (3.30mm) Beryllium Copper Tin Flash Adhesive -55°C ~ 121°C
    3-S-23T-BD-24-NTP

    3-S-23T-BD-24-NTP

    RFI FINGERSTOCK BECU UNPLAT ADH

    Leader Tech Inc.

    4,057
    RFQ
    3-S-23T-BD-24-NTP

    Datenblatt

    - Bulk Active Fingerstock - 0.230" (5.84mm) 24.000" (609.60mm) 0.030" (0.76mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
    7-19PCI-SS-14.6

    7-19PCI-SS-14.6

    RFI FINGERSTOCK BECU ADH

    Leader Tech Inc.

    1,891
    RFQ
    7-19PCI-SS-14.6

    Datenblatt

    - Bulk Active Fingerstock - 0.180" (4.57mm) 14.600" (370.84mm) 0.070" (1.78mm) Beryllium Copper - - Adhesive -55°C ~ 121°C
    7-19PCI-SS-4.6

    7-19PCI-SS-4.6

    RFI FINGERSTOCK BECU ADH

    Leader Tech Inc.

    4,286
    RFQ
    7-19PCI-SS-4.6

    Datenblatt

    - Bulk Active Fingerstock - 0.180" (4.57mm) 4.600" (116.84mm) 0.070" (1.78mm) Beryllium Copper - - Adhesive -55°C ~ 121°C
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