852-69415941
Stiftleisten, Stiftkontakte
| Foto | Hersteller-Teilenr. | Verfügbarkeit | Menge | Datenblatt | Serie | Verpackung | Produktstatus | Anschlusstyp | Kontakttyp | Abstand - Paarung | Anzahl der Positionen | Anzahl der Reihen | Reihenabstand - Paarung | Anzahl der geladenen Positionen | Stil | Ummantelung | Montageart | Anschluss | Befestigungstyp | Kontaktlänge - Paarung | Kontaktlänge - Pfosten | Gesamtkontaktlänge | Isolierhöhe | Kontaktform | Kontaktoberfläche – Paarung | Kontaktoberflächendicke - Paarung | Kontaktoberfläche - Pfosten | Kontaktmaterial | Isoliermaterial | Funktionen | Betriebstemperatur | Stromstärke (Ampere) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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51025-11-0100-01WIRE-TO BOARD WAFER, 2.5MM, 11 C |
2,889 |
|
Datenblatt |
- | Bag | Active | Header | Male Pin | 0.098" (2.50mm) | 11 | 1 | - | All | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole | Kinked Pin, Solder | Detent Lock | - | 0.134" (3.40mm) | - | 0.276" (7.00mm) | Square | Tin | - | Tin | Brass | Polyamide (PA66), Nylon 6/6 | - | -25°C ~ 85°C | 3A |
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|
DF13A-6P-1.25H(75)CONN HEADER SMD R/A 6POS 1.25MM |
2,888 |
|
Datenblatt |
DF13 | Tube | Obsolete | Header | Male Pin | 0.049" (1.25mm) | 6 | 1 | - | All | Board to Cable/Wire | Shrouded - 4 Wall | Surface Mount, Right Angle | Solder | Detent Lock | - | - | - | 0.142" (3.60mm) | Square | Tin | 39.4µin (1.00µm) | Tin | Brass | Polyamide (PA), Nylon | Solder Retention | -35°C ~ 85°C | 1A |
|
HTSW-101-06-G-DCONN HEADER VERT 2POS |
1,849 |
|
Datenblatt |
HTSW | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
HTSW-101-09-G-DCONN HEADER VERT 2POS |
3,781 |
|
Datenblatt |
HTSW | Bulk | Active | Header | Male Pin | - | 2 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.230" (5.84mm) | 0.400" (10.16mm) | 0.730" (18.54mm) | 0.100" (2.54mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | Varies by Wire Gauge |
|
|
HTSW-101-24-G-DCONN HEADER VERT 2POS |
4,358 |
|
Datenblatt |
HTSW | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
HTSW-101-25-G-DCONN HEADER VERT 2POS |
1,449 |
|
Datenblatt |
HTSW | Bulk | Active | Header | Male Pin | - | 2 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.320" (8.13mm) | 0.210" (5.33mm) | 0.630" (16.00mm) | 0.100" (2.54mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | Varies by Wire Gauge |
|
52025-10-0100-01WIRE-TO BOARD WAFER, 2.5MM, 10 C |
2,751 |
|
Datenblatt |
- | Bag | Active | Header | Male Pin | 0.098" (2.50mm) | 10 | 1 | - | All | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole | Solder | Detent Lock | - | 0.138" (3.50mm) | - | 0.232" (5.90mm) | Circular | Tin | - | Tin | Brass | Polyamide (PA66), Nylon 6/6 | - | -40°C ~ 85°C | 3A |
|
|
TSW-102-07-TM-DCONN HEADER VERT 4POS 2.54MM |
1,169 |
|
Datenblatt |
TSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 4 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.230" (5.84mm) | 0.100" (2.54mm) | 0.430" (10.92mm) | 0.100" (2.54mm) | Square | Tin | - | Tin | Phosphor Bronze | Polybutylene Terephthalate (PBT) | - | -55°C ~ 105°C | - |
|
|
STA12-05WH-ET1.25 MM W TO B CONNECTOR 5P HEAD |
2,200 |
|
Datenblatt |
STA | Tape & Reel (TR) | Active | Header | Male Pin | 0.049" (1.25mm) | 5 | 1 | - | All | Board to Cable/Wire | Shrouded - 4 Wall | Surface Mount, Right Angle | Solder | Locking Ramp | - | - | - | 0.169" (4.30mm) | Square | Tin | - | Tin | Phosphor Bronze | Polyamide (PA6T), Nylon 6T, Glass Filled | - | -40°C ~ 85°C | 1.5A |
|
|
TSW-104-07-TM-SCONN HEADER VERT 4POS 2.54MM |
4,501 |
|
Datenblatt |
TSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 4 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.230" (5.84mm) | 0.100" (2.54mm) | 0.430" (10.92mm) | 0.100" (2.54mm) | Square | Tin | - | Tin | Phosphor Bronze | Polybutylene Terephthalate (PBT) | - | -55°C ~ 105°C | - |
|
|
HTSW-102-16-G-SCONN HEADER VERT 2POS 2.54MM |
1,997 |
|
Datenblatt |
HTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 2 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.320" (8.13mm) | 0.310" (7.87mm) | 0.730" (18.54mm) | 0.100" (2.54mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | Varies by Wire Gauge |
|
|
HTSW-102-22-G-SCONN HEADER VERT 2POS 2.54MM |
3,483 |
|
Datenblatt |
HTSW | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
HTSW-102-25-G-SCONN HEADER VERT 2POS 2.54MM |
2,426 |
|
Datenblatt |
HTSW | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
MTLW-101-10-G-S-415CONN HEADER THROUGH HOLE 1POS |
4,681 |
|
Datenblatt |
Flex Stack, MTLW | Bulk | Active | Header | Male Pin | - | 1 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.415" (10.54mm) | 0.355" (9.02mm) | 0.830" (21.08mm) | 0.060" (1.52mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 5.2A per Contact |
|
|
MTMM-101-05-G-S-259CONN HEADER VERT 1POS |
3,126 |
|
Datenblatt |
MTMM | Bulk | Active | Header, Cuttable | Male Pin | - | 1 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.259" (6.58mm) | 0.059" (1.50mm) | 0.377" (9.58mm) | 0.059" (1.50mm) | Square | Gold | 20.0µin (0.51µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 3A |
|
|
MTMM-101-05-G-S-310CONN HEADER VERT 1POS |
4,590 |
|
Datenblatt |
MTMM | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
52125-08-0200-01WIRE-TO BOARD HEADER, 2.5MM, 8 C |
1,837 |
|
Datenblatt |
- | Bag | Active | Header | Male Pin | 0.098" (2.50mm) | 8 | 1 | - | All | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole, Right Angle | Solder | Detent Lock | - | 0.138" (3.50mm) | - | 0.193" (4.90mm) | Circular | Tin | - | Tin | Brass | Polyamide (PA66), Nylon 6/6 | - | -40°C ~ 85°C | 3A |
|
|
MTMM-101-14-T-D-613CONN HEADER VERT 2POS |
4,570 |
|
Datenblatt |
MTMM | Bulk | Active | Header, Cuttable | Male Pin | - | 2 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.613" (15.57mm) | 0.079" (2.00mm) | 0.751" (19.08mm) | 0.059" (1.50mm) | Square | Tin | - | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 105°C | 3A |
|
|
HMTMS-101-54-L-S-230CONN HDR .050" 1POS |
4,079 |
|
Datenblatt |
Flex Stack, HMTMS | Bulk | Active | Header | Male Pin | - | 1 | 1 | - | All | Board to Board | Unshrouded | Through Hole | Solder | Push-Pull | 0.230" (5.84mm) | 0.225" (5.72mm) | 0.555" (14.10mm) | 0.100" (2.54mm) | Square | Gold | 10.0µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | - |
|
|
TSW-101-17-T-TCONN HEADER VERT 3POS |
1,688 |
|
Datenblatt |
TSW | Bulk | Active | Header | Male Pin | - | 3 | 3 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.620" (15.75mm) | 0.110" (2.79mm) | 0.830" (21.08mm) | 0.100" (2.54mm) | Square | Tin | - | Tin | Phosphor Bronze | Polybutylene Terephthalate (PBT) | - | -55°C ~ 105°C | - |
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