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    Hersteller Serie Verpackung/Gehäuse Verpackung Produktstatus Anwendungen Strom - Versorgung Spannung - Versorgung Betriebstemperatur Klasse Qualifizierung Montageart Lieferant Gerätepaket

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    Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung/Gehäuse Verpackung Produktstatus Anwendungen Strom - Versorgung Spannung - Versorgung Betriebstemperatur Klasse Qualifizierung Montageart Lieferant Gerätepaket
    MC33PF8200DBESR2

    MC33PF8200DBESR2

    POWER MANAGEMENT IC I.MX8 PRE-PR

    NXP USA Inc.

    2,374
    RFQ
    MC33PF8200DBESR2

    Datenblatt

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC33PF8200EMESR2

    MC33PF8200EMESR2

    POWER MANAGEMENT IC I.MX8 PRE-PR

    NXP USA Inc.

    2,245
    RFQ
    MC33PF8200EMESR2

    Datenblatt

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC33PF8200ETESR2

    MC33PF8200ETESR2

    POWER MANAGEMENT IC I.MX8 PRE-PR

    NXP USA Inc.

    3,104
    RFQ
    MC33PF8200ETESR2

    Datenblatt

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC33PF8200A0ESR2

    MC33PF8200A0ESR2

    POWER MANAGEMENT IC I.MX8 NON-PR

    NXP USA Inc.

    3,784
    RFQ
    MC33PF8200A0ESR2

    Datenblatt

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC33PF8200DNESR2

    MC33PF8200DNESR2

    POWER MANAGEMENT IC I.MX8 PRE-PR

    NXP USA Inc.

    4,610
    RFQ
    MC33PF8200DNESR2

    Datenblatt

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC33PF8200DMESR2

    MC33PF8200DMESR2

    POWER MANAGEMENT IC I.MX8 PRE-PR

    NXP USA Inc.

    2,699
    RFQ
    MC33PF8200DMESR2

    Datenblatt

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC33PF8200DFESR2

    MC33PF8200DFESR2

    POWER MANAGEMENT IC I.MX8 PRE-PR

    NXP USA Inc.

    2,666
    RFQ
    MC33PF8200DFESR2

    Datenblatt

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC33PF8200DHESR2

    MC33PF8200DHESR2

    POWER MANAGEMENT IC I.MX8 PRE-PR

    NXP USA Inc.

    4,231
    RFQ
    MC33PF8200DHESR2

    Datenblatt

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC33PF8200ESESR2

    MC33PF8200ESESR2

    POWER MANAGEMENT IC I.MX8 PRE-PR

    NXP USA Inc.

    4,160
    RFQ
    MC33PF8200ESESR2

    Datenblatt

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
    MC33PF8200CXESR2

    MC33PF8200CXESR2

    POWER MANAGEMENT IC I.MX8 PRE-PR

    NXP USA Inc.

    3,107
    RFQ
    MC33PF8200CXESR2

    Datenblatt

    - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
    UCD9240RGCR

    UCD9240RGCR

    IC DGTL PWM SYSTEM CTRLR 64VQFN

    Texas Instruments

    2,056
    RFQ
    UCD9240RGCR

    Datenblatt

    Fusion Digital Power™ 64-VFQFN Exposed Pad Tape & Reel (TR) Active Special Purpose - 3V ~ 3.6V -40°C ~ 110°C - - Surface Mount 64-VQFN (9x9)
    TWL6032A2B6YFFT

    TWL6032A2B6YFFT

    IC PWR/BATT MGMT 155DSBGA

    Texas Instruments

    3,957
    RFQ
    TWL6032A2B6YFFT

    Datenblatt

    - 155-UFBGA, DSBGA Tape & Reel (TR) Discontinued at Digi-Key Handheld/Mobile Devices, OMAP™ 20µA 2.5V ~ 4.8V -40°C ~ 85°C - - Surface Mount 155-DSBGA (5.21x5.36)
    MC35FS6512CAER2

    MC35FS6512CAER2

    FS6500

    NXP USA Inc.

    4,620
    RFQ
    MC35FS6512CAER2

    Datenblatt

    - 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
    MC35FS4501CAE

    MC35FS4501CAE

    FS4500

    NXP USA Inc.

    2,228
    RFQ
    MC35FS4501CAE

    Datenblatt

    - 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
    MC35FS6501CAE

    MC35FS6501CAE

    FS6500

    NXP USA Inc.

    4,281
    RFQ
    MC35FS6501CAE

    Datenblatt

    - 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
    MC34PF8100FJEP

    MC34PF8100FJEP

    POWER MANAGEMENT IC, I.MX8, PRE-

    NXP USA Inc.

    1,722
    RFQ
    MC34PF8100FJEP

    Datenblatt

    - 56-VFQFN Exposed Pad Tray Active Processor 10µA 2.5V ~ 5.5V -40°C ~ 105°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
    LT8253AHUFDM#TRPBF

    LT8253AHUFDM#TRPBF

    40V USB TYPE-C PD 60W 4-SW BUCK-

    Analog Devices Inc.

    2,767
    RFQ
    LT8253AHUFDM#TRPBF

    Datenblatt

    - 28-WFQFN Exposed Pad Tape & Reel (TR) Active USB, Type-C Controller 2.1mA 4V ~ 40V -40°C ~ 150°C (TJ) - - Surface Mount, Wettable Flank 28-QFN (4x5)
    MC35FS6508CAER2

    MC35FS6508CAER2

    SYSTEM BASIS CHIP, DCDC 0.8A VCO

    NXP USA Inc.

    3,668
    RFQ
    MC35FS6508CAER2

    Datenblatt

    - 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
    MC34FS6407NAER2

    MC34FS6407NAER2

    SYSTEM BASIS CHIP CAN 5V 0.7

    NXP USA Inc.

    1,043
    RFQ
    MC34FS6407NAER2

    Datenblatt

    - 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip 13mA 2.7V ~ 36V -40°C ~ 125°C (TA) - - Surface Mount 48-HLQFP (7x7)
    TPS65073RSLR

    TPS65073RSLR

    IC PWR MGMT 5CH W/2 LDO 48VQFN

    Texas Instruments

    1,208
    RFQ
    TPS65073RSLR

    Datenblatt

    - 48-VFQFN Exposed Pad Tape & Reel (TR) Active Mobile/OMAP™ - 2.8V ~ 6.3V -40°C ~ 85°C - - Surface Mount 48-VQFN (6x6)
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